Please use this identifier to cite or link to this item: http://hdl.handle.net/11455/46688
標題: High-aspect-ratio microstructure filling by centrifugal force field modeling
作者: Tsai, T.H.
楊錫杭
Yang, H.
Chein, R.
簡瑞與
關鍵字: capillaries;flow
Project: Microsystem Technologies-Micro-and Nanosystems-Information Storage and Processing Systems
期刊/報告no:: Microsystem Technologies-Micro-and Nanosystems-Information Storage and Processing Systems, Volume 10, Issue 6-7, Page(s) 571-577.
摘要: 
This paper addresses the influence of centrifugal force and surface tension on the fluid filling processes in high-aspect-ratio microstructures. The microstructure was treated as a porous media. Numerical solutions are obtained for different parameters that governing the fluid filling flow phenomena. It was found that at certain high rotation speed of the filling system, efficient filling can be attained regardless surface is hydrophobic or hydrophilic. The pressure distribution during the filling process is also addressed. It is found that pressure variations along the filling length were almost in linear fashion from inlet pressure to the capillary pressure for both complete and incomplete filling.
URI: http://hdl.handle.net/11455/46688
ISSN: 0946-7076
DOI: 10.1007/s00542-004-0397-0
Appears in Collections:精密工程研究所

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