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標題: Cup-shaped copper heat spreader in multi-chip high-power LEDs application
作者: Horng, Ray Hua
Hu, Hung Lieh
Lin, Re Ching
Tang, Li Shen
Hsu, Chen Peng
Ou, Sin Liang
Project: Optics Express, Volume 20, Issue S5, page(s) A597-A605.
In this study, cup-shaped copper sheets were developed to
improve heat dispassion for high-power light emitting diodes (LEDs) array
module (3 � 3, 4 � 4, and 5 � 5) using an electroplating technique. The cupshaped
copper sheets were directly contacted with sapphire to enhance the
heat dissipation of the chip itself. The lateral emitting light extraction and
heat dissipation of high-power LEDs were enhanced and efficient. The
surface temperature was not only decreasing but also uniform for each LED
chip with the cup-shaped copper heat spreader adoption. The high thermal
transmitting performance of cup-shaped copper heat spreader allows
thermal resistance reducing 0.7, 0.6, and 0.7 K/W of 3 � 3, 4 � 4, and 5 � 5
LED array module, respectively. In addition, the light output power was
increased of 14, 13, and 12% with 3 � 3, 4 � 4, and 5 � 5 LEDs array
module using cup-shaped copper sheet at high current injection. High heat
dissipation performance and light extraction were obtained by cup-shaped
copper sheet with copper bulk and silver mirror.
DOI: 10.1364/OE.20.00A597
Appears in Collections:精密工程研究所

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