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http://hdl.handle.net/11455/46719
標題: | (Journal of Micromechanics and Microengineering,14(6):1197-1204)High fill-factor microlens array mold insert fabrication using a thermal reflow process | 作者: | H. Yang C.K. Chao M.K. Wei C.P. Lin |
關鍵字: | High fill-factor;microlens array mold;insert fabrication;thermal reflow process | 出版社: | USA:Institute of Physics Publishing | Project: | Journal of Micromechanics and Microengineering, Volume 14, Issue 6, Page(s) 1197-1204. | URI: | http://hdl.handle.net/11455/46719 |
Appears in Collections: | 精密工程研究所 |
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