Please use this identifier to cite or link to this item: http://hdl.handle.net/11455/46719
標題: (Journal of Micromechanics and Microengineering,14(6):1197-1204)High fill-factor microlens array mold insert fabrication using a thermal reflow process
作者: H. Yang
C.K. Chao
M.K. Wei
C.P. Lin
關鍵字: High fill-factor;microlens array mold;insert fabrication;thermal reflow process
出版社: USA:Institute of Physics Publishing
Project: Journal of Micromechanics and Microengineering, Volume 14, Issue 6, Page(s) 1197-1204.
URI: http://hdl.handle.net/11455/46719
Appears in Collections:精密工程研究所

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