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http://hdl.handle.net/11455/46723| 標題: | (Microsystem Technologies,10(5):351-356)New electroforming technology pressure aid for LIGA process | 作者: | T.H. Tsai H. Yang R. Chein |
關鍵字: | New electroforming technology;pressure aid;LIGA process | 出版社: | Germany:Springer Berlin | Project: | Microsystem Technologies, Volume 10, Issue 5, Page(s) 351-356. | URI: | http://hdl.handle.net/11455/46723 |
| Appears in Collections: | 精密工程研究所 |
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