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http://hdl.handle.net/11455/46724| 標題: | (Microsystem Technologies,10(7):571-577)High-aspect-ratio microstructure filling by centrifugal force field modeling | 作者: | T.H. Tsai H. Yang R. Chein |
關鍵字: | High-aspect-ratio;microstructure filling;centrifugal force field modeling | 出版社: | Germany:Springer Berlin | Project: | Microsystem Technologies, Volume 10, Issue 7, Page(s) 571-577. | URI: | http://hdl.handle.net/11455/46724 |
| Appears in Collections: | 精密工程研究所 |
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