Please use this identifier to cite or link to this item:
http://hdl.handle.net/11455/46733
DC Field | Value | Language |
---|---|---|
dc.contributor.author | M.C. Chou | en_US |
dc.contributor.author | H. Yang | en_US |
dc.contributor.author | S.H. Yeh | en_US |
dc.contributor.other | 國立中興大學精密工程所 | zh_TW |
dc.date | 2001 | zh_TW |
dc.date.accessioned | 2014-06-06T08:20:41Z | - |
dc.date.available | 2014-06-06T08:20:41Z | - |
dc.identifier.uri | http://hdl.handle.net/11455/46733 | - |
dc.format | application/pdf | en_US |
dc.language.iso | en_US | zh_TW |
dc.publisher | Germany:Springer Berlin | en_US |
dc.relation | Microsystem Technologies,07:036-039 | en_US |
dc.subject | Microcomposite electroforming | en_US |
dc.subject | LIGA technology | en_US |
dc.title | (Microsystem Technologies,07:036-039)Microcomposite electroforming for LIGA technology | en_US |
item.languageiso639-1 | en_US | - |
item.grantfulltext | none | - |
item.fulltext | no fulltext | - |
Appears in Collections: | 精密工程研究所 |
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