Please use this identifier to cite or link to this item: http://hdl.handle.net/11455/46733
DC FieldValueLanguage
dc.contributor.authorM.C. Chouen_US
dc.contributor.authorH. Yangen_US
dc.contributor.authorS.H. Yehen_US
dc.contributor.other國立中興大學精密工程所zh_TW
dc.date2001zh_TW
dc.date.accessioned2014-06-06T08:20:41Z-
dc.date.available2014-06-06T08:20:41Z-
dc.identifier.urihttp://hdl.handle.net/11455/46733-
dc.formatapplication/pdfen_US
dc.language.isoen_USzh_TW
dc.publisherGermany:Springer Berlinen_US
dc.relationMicrosystem Technologies,07:036-039en_US
dc.subjectMicrocomposite electroformingen_US
dc.subjectLIGA technologyen_US
dc.title(Microsystem Technologies,07:036-039)Microcomposite electroforming for LIGA technologyen_US
item.languageiso639-1en_US-
item.grantfulltextnone-
item.fulltextno fulltext-
Appears in Collections:精密工程研究所
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