Please use this identifier to cite or link to this item:
http://hdl.handle.net/11455/46739
DC Field | Value | Language |
---|---|---|
dc.contributor.author | C.P. Lin | en_US |
dc.contributor.author | H. Yang | en_US |
dc.contributor.author | C.K. Chao | en_US |
dc.contributor.other | 國立中興大學精密工程所 | zh_TW |
dc.date | 2003 | zh_TW |
dc.date.accessioned | 2014-06-06T08:20:42Z | - |
dc.date.available | 2014-06-06T08:20:42Z | - |
dc.identifier.uri | http://hdl.handle.net/11455/46739 | - |
dc.format | application/pdf | en_US |
dc.language.iso | en_US | zh_TW |
dc.publisher | USA:Institute of Physics Publishing | en_US |
dc.relation | Journal of Micromechanics and Microengineering, Volume 13, Issue 5, Page(s) 775-781. | en_US |
dc.subject | Hexagonal microlens array modeling | en_US |
dc.subject | fabrication | en_US |
dc.subject | a thermal reflow process | en_US |
dc.title | ( Journal of Micromechanics and Microengineering,13(5):775-781)Hexagonal microlens array modeling and fabrication using a thermal reflow process | en_US |
item.grantfulltext | none | - |
item.fulltext | no fulltext | - |
item.languageiso639-1 | en_US | - |
Appears in Collections: | 精密工程研究所 |
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