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http://hdl.handle.net/11455/47462
標題: | Characterization of Plasma Treatment on Flexible Substrates (I) 介電鍍膜低溫製程之開發與其在前瞻資訊產業之應用-子計畫I:前瞻性可撓性基材開發與電漿表面處理特性研究(I) |
作者: | 吳宗明 | 關鍵字: | 應用研究;材料科技 | URI: | http://hdl.handle.net/11455/47462 | 其他識別: | NSC91-2216-E005-022 |
Appears in Collections: | 材料科學與工程學系 |
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