Please use this identifier to cite or link to this item: http://hdl.handle.net/11455/47493
標題: 介電鍍膜低溫製程之開發與其在前瞻資訊產業之應用-子計劃七:可撓性基材介電鍍膜之高密度電漿混合製程與元件應用(III)
Dielectric Coating and Device Applications of Flexible Substrates by High-Density-Plasma Treatment and Deposition(III)
作者: 武東星
關鍵字: 應用研究;材料科技
URI: http://hdl.handle.net/11455/47493
其他識別: NSC93-2216-E005-008
Appears in Collections:材料科學與工程學系

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