Please use this identifier to cite or link to this item: http://hdl.handle.net/11455/56158
DC FieldValueLanguage
dc.contributor惲軼群zh_TW
dc.contributor陳文郎zh_TW
dc.contributor.author武東星zh_TW
dc.contributor.authorCHIANG, CHENG CHUNGen_US
dc.contributor.author蔣承忠zh_TW
dc.contributor.author陳永培zh_TW
dc.contributor.author洪瑞華zh_TW
dc.contributor.authorCHEN, YUNG PEIen_US
dc.date2007-09zh_TW
dc.date.accessioned2014-06-06T09:05:22Z-
dc.date.available2014-06-06T09:05:22Z-
dc.identifier.urihttp://hdl.handle.net/11455/56158-
dc.description.abstract本發明是軟性薄膜電晶體基板的製造方法及軟性薄膜電晶體基板,製造方法是先在玻璃載板上以有機材料(聚對二甲基苯)沉積形成可直接自該玻璃載板剝離的離型性薄膜後,接著,可選擇性地以無機材料與有機材料形成無機層膜與有機層膜的順序,在離型性薄膜上形成至少一無機層膜後,再形成非晶矽或多晶矽薄膜電晶體,最後,直接將設置有薄膜電晶體的離型性薄膜從玻璃載板上撕離,即可製得軟性薄膜電晶體基板,本發明較目前以塑膠作為承載基材更具有良好的耐化性、熱穩定性、阻氣性、阻水性與高穿透率,且較以金屬或玻璃具有更優異的可撓性。zh_TW
dc.language.isozh_TWzh_TW
dc.publisher材料科學與工程學系zh_TW
dc.relation.urihttp://twpat.tipo.gov.tw/tipotwoc/tipotwkmen_US
dc.title軟性薄膜電晶體基板的製造方法及軟性薄膜電晶體基板zh_TW
dc.typePatentzh_TW
item.openairecristypehttp://purl.org/coar/resource_type/c_18cf-
item.fulltextno fulltext-
item.grantfulltextnone-
item.cerifentitytypePublications-
item.languageiso639-1zh_TW-
item.openairetypePatent-
Appears in Collections:材料科學與工程學系
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