Please use this identifier to cite or link to this item: http://hdl.handle.net/11455/56844
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dc.contributor.authorHorng, Ray-Huaen_US
dc.contributor.authorWuu, Dong-Singen_US
dc.contributor.other國立中興大學精密工程研究所zh_TW
dc.contributor.otherNational Chung Hsing University,Graduate Institute of Precision Engineeringen_US
dc.date2011-8-16zh_TW
dc.date.accessioned2014-06-06T09:06:53Z-
dc.date.available2014-06-06T09:06:53Z-
dc.identifier.urihttp://hdl.handle.net/11455/56844-
dc.description.abstractA method for forming a light emitting diode includes: (a) growing epitaxially an epitaxial film over an epitaxial substrate; (b) roughening an upper surface of the epitaxial film; (c) forming a top electrode on the roughened upper surface of the epitaxial film; (d) detachably attaching a temporary substrate over the roughened upper surface of the epitaxial film; (e) roughening the lower surface of the epitaxial film; (f) disposing the roughened lower surface of the epitaxial film on a reflective top surface of an electrically conductive permanent substrate; (g) filling an optical adhesive in a gap between the roughened lower surface of the epitaxial film and the reflective top surface of the permanent substrate; and (h) after the step (g), removing the temporary substrate from the epitaxial film.en_US
dc.language.isoen_USzh_TW
dc.titleMethod for forming a light emitting diodeen_US
dc.typePatentzh_TW
dc.contributor.catalogerMiao-zhen Luoen_US
item.fulltextwith fulltext-
item.grantfulltextrestricted-
item.openairetypePatent-
item.languageiso639-1en_US-
item.openairecristypehttp://purl.org/coar/resource_type/c_18cf-
item.cerifentitytypePublications-
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