Please use this identifier to cite or link to this item: http://hdl.handle.net/11455/56861
DC FieldValueLanguage
dc.contributor惲軼群zh_TW
dc.contributor陳文郎zh_TW
dc.contributor.author洪瑞華zh_TW
dc.contributor.author張昭智zh_TW
dc.contributor.author柯銘禮zh_TW
dc.contributor.author陳冠位zh_TW
dc.date2010-08zh_TW
dc.date.accessioned2014-06-06T09:06:54Z-
dc.date.available2014-06-06T09:06:54Z-
dc.identifier.urihttp://hdl.handle.net/11455/56861-
dc.description.abstract本發明主要提供一種動圈式麥克風晶片的製造方法,是先在基材上形成犧牲層後,接著依序自犧牲層向上定義出可導電的音圈膜、絕緣且可受聲能作用而對應形變的振膜,及可使該振膜呈預定微張力的框架單元,製得形成在該犧牲層上的動圈式麥克風晶片,最後以脫離技術蝕刻掉犧牲層,即可在無切割損耗的前提下完整取得動圈式麥克風晶片;本發明主要是應用微機電技術與半導體製程,突破機械加工的尺寸限制,精確地製作出可封裝成動圈式麥克風的動圈式麥克風晶片。zh_TW
dc.language.isozh_TWzh_TW
dc.publisher精密工程研究所zh_TW
dc.relation.urihttp://twpat.tipo.gov.tw/tipotwoc/tipotwkmen_US
dc.title動圈式麥克風晶片的製造方法zh_TW
dc.typePatentzh_TW
item.fulltextno fulltext-
item.languageiso639-1zh_TW-
item.openairetypePatent-
item.cerifentitytypePublications-
item.openairecristypehttp://purl.org/coar/resource_type/c_18cf-
item.grantfulltextnone-
Appears in Collections:精密工程研究所
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