Please use this identifier to cite or link to this item: http://hdl.handle.net/11455/66952
標題: 堆疊晶片結構之訊號傳遞方式
A METHOD OF SIGNAL TRANSMISSION FOR THE STRUCTURE OF STACKING CHIP
作者: 戴慶良
DAI, CHING LIANG
劉茂誠
LIU, MAO CHEN
摘要: 
一種堆疊晶片結構之訊號傳遞方式,該堆疊晶片結構係為工作於低頻,並且利用反應性離子蝕刻(Reactive-Ion Etching,RIE)來移除結構下方之矽基材(Si substrate)使其具有寄生效應(parasitic effect)以獲得相互堆疊的一下部傳輸晶片結構以及一上部接收晶片結構,並且利用磁偶合來做下部傳輸晶片結構及上部接收晶片結構兩者的訊號傳遞。
URI: http://hdl.handle.net/11455/66952
Appears in Collections:專利

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