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|標題:||Dewetting Retardation on Ag/Cu Coated Light Emitting Diode Lead Frames During the Solder Immersion Process||作者:||Huang, K.C.
|關鍵字:||Dewetting;retardation;light emitting diode lead frames (LED LFs);SnPb;surface finish;joints;metallurgy;reliability;cu6sn5;ni;sn||Project:||Journal of Electronic Materials||期刊/報告no：:||Journal of Electronic Materials, Volume 38, Issue 11, Page(s) 2270-2274.||摘要:||
The process of SnPb immersion in Ag/Cu coated light emitting diode lead frames (LED LFs) (alloy 42) was investigated. SnPb solder was found to cause dewetting of the LF substrate after 6 s of immersion. We believed that the dewetting of the SnPb solder could be attributed to spalling of the interfacial compound grains. The addition of a small amount of Ni to the molten SnPb solder (0.1 wt.%) retarded that spalling and helped to prevent dewetting. The mechanisms for spalling retardation by the addition of Ni additives are as follows: (1) the Ni additives slow down the reaction rate between the molten SnPb solder and the Ag/Cu plating layer; (2) the Ni additives participate in interfacial reactions to form (Cu,Ni)(6)Sn(5) ternary compounds, which are more stable than binary compounds and have a slower ripening process.
|Appears in Collections:||工學院|
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