Please use this identifier to cite or link to this item:
|標題:||Growth of intermetallic compounds in the Sn-9Zn/Cu joint||作者:||Lee, C.S.
|關鍵字:||intermetallic compounds (IMCs);Sn-9Zn solder;soldering;activation;energy;flip-chip technology;interfacial reactions;soldering reaction;reaction-products;eutectic snpb;cu;prediction;alloys;copper;layer||Project:||Journal of Electronic Materials||期刊/報告no：:||Journal of Electronic Materials, Volume 35, Issue 8, Page(s) 1660-1664.||摘要:||
We have studied the microstructure of the Sn-9Zn/Cu joint in soldering at temperatures ranging from 230 degrees C to 270 degrees C to understand the growth of the mechanism of intermetallic compound (IMC) formation. At the interface between the Sn-9Zn solder and Cu, the results show a scallop-type epsilon-CuZn4 and a layer-type gamma-Cu5Zn8, which grow at the interface between the Sn-9Zn solder and Cu. The activation energy of scallop-type epsilon-CuZn4 is 31 kJ/mol, and the growth is controlled by ripening. The activation energy of layer-type gamma-Cu5Zn8 is 26 kJ/mol, and the growth is controlled by the diffusion of Cu and Zn. Furthermore, in the molten Sn-9Zn solder, the results show eta-CuZn grains formed in the molten Sn-9Zn solder at 230 degrees C. When the soldering temperature increases to 250 degrees C and 270 degrees C, the phase of IMCs is epsilon-CuZn4.
|Appears in Collections:||工學院|
Show full item record
TAIR Related Article
Items in DSpace are protected by copyright, with all rights reserved, unless otherwise indicated.