Please use this identifier to cite or link to this item: http://hdl.handle.net/11455/67601
標題: Growth of intermetallic compounds in the Sn-9Zn/Cu joint
作者: Lee, C.S.
薛富盛
Shieu, F.S.
關鍵字: intermetallic compounds (IMCs);Sn-9Zn solder;soldering;activation;energy;flip-chip technology;interfacial reactions;soldering reaction;reaction-products;eutectic snpb;cu;prediction;alloys;copper;layer
Project: Journal of Electronic Materials
期刊/報告no:: Journal of Electronic Materials, Volume 35, Issue 8, Page(s) 1660-1664.
摘要: 
We have studied the microstructure of the Sn-9Zn/Cu joint in soldering at temperatures ranging from 230 degrees C to 270 degrees C to understand the growth of the mechanism of intermetallic compound (IMC) formation. At the interface between the Sn-9Zn solder and Cu, the results show a scallop-type epsilon-CuZn4 and a layer-type gamma-Cu5Zn8, which grow at the interface between the Sn-9Zn solder and Cu. The activation energy of scallop-type epsilon-CuZn4 is 31 kJ/mol, and the growth is controlled by ripening. The activation energy of layer-type gamma-Cu5Zn8 is 26 kJ/mol, and the growth is controlled by the diffusion of Cu and Zn. Furthermore, in the molten Sn-9Zn solder, the results show eta-CuZn grains formed in the molten Sn-9Zn solder at 230 degrees C. When the soldering temperature increases to 250 degrees C and 270 degrees C, the phase of IMCs is epsilon-CuZn4.
URI: http://hdl.handle.net/11455/67601
ISSN: 0361-5235
DOI: 10.1007/s11664-006-0214-x
Appears in Collections:工學院

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