Please use this identifier to cite or link to this item: http://hdl.handle.net/11455/67715
標題: Copper emission during thermal treatment of simulated copper sludge
作者: Chou, J.D.
Lin, C.L.
Hsien, Y.L.
Wey, M.Y.
Chang, S.H.
關鍵字: copper;sludge;emission;sintering;rotary kiln;fly-ash;industrial sludge;sewage-sludge;wastes;clay;recovery;metals;reuse;co
Project: Environmental Technology
期刊/報告no:: Environmental Technology, Volume 33, Issue 1, Page(s) 17-25.
摘要: 
This study evaluates Cu emissions in air-particulate and gas phases during thermal treatment of simulated copper sludge by a rotary kiln. Influences of operating parameters, including treatment temperature (400-700 degrees C), rotary speed (0.89-2.00 rpm) and copper content in sludge (1% to 5% by weight) on copper emissions were investigated. The toxicity characteristic leaching procedure (TCLP) and scanning electron microscopy (SEM) were also conducted to evaluate copper leaching and the surface structure of thermally treated sludge, respectively. The results indicated that (1) low Cu emissions in air-particulate and gas phases were associated with the two operating conditions of 400-500 degrees C at 0.89-1.39 rpm and 600-700 degrees C at 2.00 rpm; (2) temperatures and rotary speeds did not affect gaseous copper emission, except for the operating condition of 400 degrees C at 2.00 rpm; (3) rising copper content of sludge at 600 degrees C and 2.00 rpm increased the particulate copper emission, but not the gaseous copper emission; (5) the TCLP copper leaching concentrations of sludge treated at 400 degrees C were obviously higher than those treated at 500-700 degrees C; however, all of the thermally treated products agreed with the Taiwan EPA TCLP regulations.
URI: http://hdl.handle.net/11455/67715
ISSN: 0959-3330
DOI: 10.1080/09593330.2010.490853
Appears in Collections:期刊論文

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