Please use this identifier to cite or link to this item: http://hdl.handle.net/11455/68072
標題: Formation of TiSi2 thin films on stressed (001)Si substrates
作者: Cheng, S.L.
Huang, H.Y.
Peng, Y.C.
Chen, L.J.
Tsui, B.Y.
Tsai, C.J.
Guo, S.S.
Yang, Y.R.
Lin, J.T.
關鍵字: stress;silicide;amorphous interlayer;nucleation;silicon
Project: Applied Surface Science
期刊/報告no:: Applied Surface Science, Volume 142, Issue 1-4, Page(s) 295-299.
摘要: 
The effects of stress on the formation of TiSi2 thin films have been investigated. Compressive stress present in the silicon substrate was found to retard significantly the transformation of high-resistivity C49-TiSi2 to low-resistivity C54-TiSi2. On the other hand, the tensile stress present in the silicon substrate was found to promote the formation of C54-TiSi2. For Ti on stressed (001)Si substrates after rapid thermal annealing (RTA), the thickness of TiSi2 films was found to decrease and increase with the compressive and tensile stress level, respectively. In addition, the thickness of amorphous interlayers (a-interlayers) between Ti films and silicon substrates was found to be thicker and thinner in the compressively and tensile-stressed samples, respectively. The results indicated that the compressive stress hinders the migration of Si through the Ti/Si interface, so that the transformation of C49- to C54-TiSi2 is retarded. In contrast, the tensile stress promotes the Si diffusion to facilitate the formation of C54-TiSi2. (C) 1999 Elsevier Science B.V. All rights reserved.
URI: http://hdl.handle.net/11455/68072
ISSN: 0169-4332
DOI: 10.1016/s0169-4332(98)00733-8
Appears in Collections:期刊論文

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