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標題: Enhanced growth of the Ni3Sn4 phase at the Sn/Ni interface subjected to strains
作者: Liao, W.K.
Chen, C.M.
Lin, M.T.
Wang, C.H.
關鍵字: Intermetallic compounds;Nickel;Grain growth;Strain;ni;sn;solder;metallization;temperature;diffusion;thickness
Project: Scripta Materialia
期刊/報告no:: Scripta Materialia, Volume 65, Issue 8, Page(s) 691-694.
A Sn/Ni bilayer deposited on a Si substrate is subjected to tensile or compressive strain under three-point bending to investigate the Sn/Ni interfacial reactions under strain. Both tensile and compressive strains are found to have enhanced effects on the growth of the Ni3Sn4 phase which formed at the Sn/Ni interface when it was aged at 200 degrees C. When subjected to strains, the Ni layer exhibits significant microstructure evolution, which is suggested to play a crucial role in the enhanced growth of the Ni3Sn4 phase. (C) 2011 Acta Materialia Inc. Published by Elsevier Ltd. All rights reserved.
ISSN: 1359-6462
DOI: 10.1016/j.scriptamat.2011.07.007
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