Please use this identifier to cite or link to this item: http://hdl.handle.net/11455/71487
標題: Metal-doped diamond-like carbon films synthesized by filter-arc deposition
作者: Weng, K.W.
Chen, Y.C.
Lin, T.N.
Wang, D.Y.
關鍵字: diamond-like Carbon films (DLC);filter-arc deposition (FAD);cathodic;arc evaporation (CAE);tribological property;amorphous-carbon;ion-beam;temperature;evaporation
Project: Thin Solid Films
期刊/報告no:: Thin Solid Films, Volume 515, Issue 3, Page(s) 1053-1057.
摘要: 
Diamond-like carbon (DLC) thin films are extensively utilized in the semiconductor, electric and cutting machine industries owing to their high hardness, high elastic modulus, low friction coefficients and high chemical stability. DLC films are prepared by ion beam-assisted deposition (BAD), sputter deposition, plasma-enhanced chemical vapor deposition (PECVD), cathodic arc evaporation (CAE), and filter arc deposition (FAD). The major drawbacks of these methods are the degraded hardness associated with the low sp(3)/sp(2) bonding ratio, the rough surface and poor adhesion caused by the presence of particles. In this study, a self-developed filter arc deposition (FAD) system was employed to prepare metal-containing DLC films with a low particle density. The relationships between the DLC film properties, such as film structure, surface morphology and mechanical behavior, with variation of substrate bias and target current, are examined. Experimental results demonstrate that FAD-DLC films have a lower ratio, suggesting that FAD-DLC films have a greater sp(3) bonding than the CAE-DLC films. FAD-DLC films also exhibit a low friction coefficient of 0.14 and half of the number of surface particles as in the CAE-DLC films. Introducing a CrN interfacial layer between the substrate and the DLC films enables the magnetic field strength of the filter to be controlled to improve the adhesion and effectively eliminate the contaminating particles. Accordingly, the FAD system improves the tribological properties of the DLC films. (c) 2006 Elsevier B.V. All rights reserved.
URI: http://hdl.handle.net/11455/71487
ISSN: 0040-6090
DOI: 10.1016/j.tsf.2006.07.064
Appears in Collections:期刊論文

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