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標題: 低溫共燒陶瓷嵌入式電容與共振器元件之研究
Analysis Of Embedded Capacitors and Resonators in Low-Temperature Cofired Creamic Technology
作者: 陳李坤
Chen, Li-Kun
關鍵字: LTCC;低溫共燒陶瓷;capacitor;resonator;hairpin;電容;共振器;髮夾型
出版社: 電機工程學系所
引用: [1] L.Kyutae, S. Pinel, M. Davis, A. Sutono, L. H. Chang, H.Deukhyoun, A. Obatoynbo, J. Laskar, E. M. Tantzeris, and R. Tummala ,” RF system on package (SOP) for wireless communications, ” IEEEMicrowave Magazine, vol. 3, pp. 88-99, Mar 2002 [2] Sutono,D. Heo,Y.-J.E. Chen, and J. Laskar, “High-Q LTCC-based passive library for wireless system-on-package (SOP) module development,” IEEE Transactions on Microwave Theory and Techchniques, vol. 49, pp. 1715-1724, Oct. 2001 [3] S.Chakraborty, K. Lim, A. Sutono, E. Chen, S. Yoo, A. Obatoyinbo, and J. Laskar, “Development of an integrated Bluetooth RF transceiver module using multi-layer system on package technology,” 2001 Radio and Wireless Conference, pp. 117-120, 2001 [4] L. Kyutae, A. Obatoyinbo, A. Sutono, S. Chakraborty, L. H. Chang, E. Gebara, A. Raghavan, and J. Laskar,”A highly integrated transceiver module for 5.8 GHz OFDM communication system using multi-layer packaging technology,” IEEE MTT-S International, vol. 3, pp. 1739-1742, May 2001 [5] L. Kyutae, A. Obatoyinbo, M. Davis, J. Laskar, and R. Tummala,” Development of planar antennas in multi-layer packages for RF-system-on-a-package applications,” IEEE Conference on Electrical Performance of Electronic Packaging, pp. 101 –104, 2001 [6] S. Pinel, S. Chakraborty, M. Roellig, R. Kunze, S. Mandal, H. Liang, C-H. Lee, R. Li, K. Lim, G. White, M. Tentzeris and J. Laskar, “3D Integrated LTCC Module using μ BGA technology for compact C-band RF Front-End Module,” IEEE MTT-S International, pp.1553-1556, June. 2002 [7] S. Chakraborty, K. Lim, A. Sutono, E. Chen, S. Yoo, A. Obatoyinbo, S. –W. Yoon, M. Maeng, M. F. Davis, S. Pinel, and J. Laskar, “A 2.4-GHz Radio Front End in RF System-on-Package Technology,” IEEE Microwave Magazine, vol. 3, pp. 94-104, June. 2002 [8] Hayashi, J. Nikawa, “ Improvement of characteristics using cross patch in the LTCC filter,” Volume 1, 8-13 June 2003 Page(s):531 - 534 vol.1 [9] Hsin-Chia Lu; Tzu-Wei Chao, “Capacitor and coupled inductor with high process tolerance in LTCC,” 18-20 Oct. 2006 Page(s):1 – 4 [10] Hirad Samavati , Ali Hajimiri, Arvin R. Shahani,Gitty N. Nasserbakht, and Thomas H. Lee, “Fractal Capacitors” IEEE JOURNAL OF SOLID STATE CIRCUITS, VOL. 33, NO. 12, DECEMBER 1998. [11] 楊立群, “低溫共燒陶瓷嵌入式電感與電容元件之設計與模型化,” 國立中山大學電機工程研究所碩士論文, 2002 [12] Loskot, E. Kondratiev, V. Vendik, I. Jakku, E. Leppavuori, S, “Design of Resonators and Filters based on LTCC Lumped Components,” Oct. 2000 [13] Ohk-Kun Lim; Yong-Jun Kim; Sung-Soo Lee, “A compact integrated combline band pass filter using LTCC technology for C-band wireless applications,” Volume 1, 7-9 Oct. 2003 [14] Lung-Hwa Hsieh and Kai Chang , “Compact Elliptic-Function Low-Pass Filters Using Microstrip Stepped-Impedance Hairpin Resonators” IEEE TRANSACTIONS ON MICROWAVE THEORY AND TECHNIQUES, VOL. 51, NO. 1, JANUARY 2003. [15] H. Yabuki, M. Sagawa, and M. Makimoto, “Voltage controlledpush–push oscillators using miniaturized hairpin resonators,” in IEEE MTT-S Int. Microwave Symp. Dig., 1991, pp. 1175–1178.. [16] J. T. Ku, M. J. Maa, and P. H. Lu, “A microstrip elliptic function filterwith compact miniaturized hairpin resonator,” IEEE Microwave GuidedWave Lett., vol. 10, pp. 94–95, Mar. 2000 [17] Jen-Tsai Kuo , and Hung-Sen Cheng , “Design of Quasi-Elliptic Function Filters With a Dual-Passband Response” IEEE MICROWAVE AND WIRELESS COMPONENTS LETTERS, VOL. 14, NO. 10, OCTOBER 2004 [18] Jiwen Zhu and Zhenghe Feng , “Microstrip Interdigital Hairpin ResonatorWith an Optimal Physical Length” IEEE MICROWAVE AND WIRELESS COMPONENTS LETTERS, VOL. 16, NO. 12, DECEMBER 2006. [19] M. Makimoto and S. Yamashita, “Bandpass filters using parallel coupledstripline stepped impedance resonators,” IEEE Trans. Microw . Theory Tech., vol. MTT-28, no. 12, pp. 1413–1417, Dec. 1980. [20] Mitsuo Makimoto and S.Yanashita “Microwave Resonators and Filters for Wireless Communication Theory, Design andApplication", Springer 2000, New York [21] Morikazu Sagawa, Kenichi Takahashi and Mitsuo Makimoto , “ Miniaturized Hairpin Resonator Filters and Their Application to Receiver Front-End MIC'' s”, IEEE vol 37, No 12, pp.1991-1997,Dec. 1989. [22] Jen-Tsai Kuo , and Hung-Sen Cheng , “Design of Quasi-Elliptic Function Filters With a Dual-Passband Response” , IEEE MICROWAVE AND WIRELESS COMPONENTS LETTERS, 10, OCTOBER 2004 [23] Sheng Yuan Lee and Chih Ming Tsai “ New Cross-Coupled Filter Design Using Improved Hairpin Resonator”, IEEE, vol. 48, NO. 12,pp.2482-2490, Dec 2000. [24] L.-H. Hsieh and K. Chang , “Compact lowpass filter using stepped impedance hairpin resonator” , Electron. Lett., vol. 37, no. 14, pp.899–900, July 2001. [25] MORIKAZU SAGAWA, and MITSUO MAKIMOTO, “Miniaturized Hairpin Resonator Filters and Their Application to Receiver Front-End MIC’s” , IEEE TRANSACTIONS ON MICROWAVE THEORY AND ItCHNIQlJLS. OL 37. NO 12, DFCFURFR 1989 [26] David M. Pozar, “Microwave Engineering ”third edition
本論文第一部分設計了四種LTCC 內埋式電容元件,經由傳統之π模型等效電路,萃取其電容值,經由相互比對,可知所萃取出的容值皆能與模擬十分接近,並且模型之頻率響應可準確至自我諧振頻率點附近,同時再針對四種不同結構的電容,討論其特性,比較容值的大小,找出最佳的設計。第二部分則完成了應用在壓控振盪器上的髮夾型共振器,包含了基礎理論與數學式的推導。最後,則利用之前所設計之 LTCC 內埋式電容元件,改變共振器的設計結構,並有效的縮小電路模組面積。

At the first part of the thesis, we design four kinds of LTCC embedded components capacitors. The extraction result via traditional equivalent π model and match the simulation result. Compared with the simulation result the measurement shows us the frequency response of adopted model can approach the device's Self-Resonant-Frequency. And then we would compare all four capacitors with each other and find the differences among the characteristic, find out the best design. At the second part of thesis, we design and implement a hairpin resonator of Voltage-Controlled Oscillator and introduce the basic theory and derive the mathematic types. Finally, we use the designed LTCC embedded components capacitors to change the design structure of the resonators and decrease the area of module size efficiently.
其他識別: U0005-0108200711292900
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