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|關鍵字:||Electromigration;電遷移;Lead-free solder;SnAgBiIn;無鉛銲料;錫銀鉍銦||出版社:||國立中興大學工學院;Airiti Press Inc.||Project:||興大工程學刊, Volume 21, Issue 2, Page(s) 65-71.||摘要:||
Pb-free SnAgBiIn solder strips were prepared in Si(001) U-grooves to investigate the behaviors under electromigration. Cu electrodes were electroplated in the grooves and the solders were consequently reflowed between the electrodes. The samples were tested under various temperatures and current densities. The addition of indium and bismuth decreases the melting point to 203℃. Average failure time was compared for 84Sn3Ag3Bi10In and 89Sn3Ag3Bi at the same homologous temperature. The results show longer life time of 84Sn3Ag3Bi10In than 89Sn3Ag3Bi, and the mechanism under the influence of current will be discussed in this paper.
The formation of the intermetallic compounds in the solder were either Cu 6(Sn, In) 5 or ζ-phase, while ζ-phase is the solid solution of Ag4Sn and Ag3In. The composition of compounds was analyzed by EPMA; the formation Gibbs free energy was calculated to discuss the electromigration effect on microstructure evolution. The results suggested that the existence of ζ-phase plays an important role to prolong the lifetime of SnAgBiIn solders under electromigration.
|Appears in Collections:||第21卷 第2期|
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