Sn-9wt%Zn無鉛銲料與金屬基材之界面反應

Abstract

The interfacial reactions in the Sn-9Zn lead-free solder (SZ) with Cu, Ni, Ag, Au, Au//Ni/SUS 304 and Fe-42wt%Ni (Alloy 42) substrates are systemically reported in this article. In the SZ/Cu systems, the Cu5Zn8 and Cu6Sn5 phases were formed at the interface. The Ni5Zn21 phase was formed between the SZ and Ni substrate. As Cu content were 0, 1, 4, 7, 10wt% in the SZ-xCu/Ni systems, the Ni5Zn21, Cu5Zn8, (Ni, Zn, Cu) 3Sn4, (Cu, Ni, Zn)6Sn5 and Cu6Sn5 phases were formed at the interface, respectively. In the SZ/ Ag systems, three intermetallic compound (IMC) layers, AgZn, Ag5Zn8 and AgZn3, were formed. As the Zn content was decreased, only the Ag4Sn phase was formed in the SZ/Ag system. When the Cu contents were more than 3wt%, then binary Ag-Sn IMCs were formed in the SZ-xCu/Ag system. The IMC evolution sequences at the SZ-xCu/Au interface were (1) x = 0, the Au3Zn7, AuZn2, AuZn phases were formed in the SZ/Au couple; (2) the Au3Zn7 and AuZn phases were formed in the SZ-1wt%Cu/Au couple; (3) the AuSn phase was formed in the SZ-4wt%Cu/Au couple; (4) the (Cu, Au )Sn and AuSn phases were formed, as the 7-10wt%Cu content were added to the SZ. Only the Ni5Zn21 phase was formed in the SZ/Au//Ni/SUS 304 system. The (Ni, Fe) 5Zn21 phase was formed in the SZ/Alloy 42 system.

本文系統性地整理Sn-9Zn無鉛銲料(SZ)與Cu、Ni、Au、Ag、Au//Ni/SUS 304與Fe-42wt%Ni(Alloy42)基材之界面反應。在SZ-xCu與Cu基材界面反應方面：主要生成Cu5Zn8及Cu6Sn5相。SZ與Ni基材反應會有Ni5Zn21相生成；SZ-xCu/Ni系統中，如Cu濃度?0、1、4、7與10wt%時，界面上分別會有Ni5Zn21、Cu5Zn8、(Ni, Zn, Cu)3Sn4、(Cu, Ni, Zn)6Sn5 和Cu6Sn5相之生成。SZ/Ag系統則發現有AgZn、Ag5Zn8和AgZn3等三相生成；隨著Zn含量的減少，介金屬相將轉變?Ag4Sn相。當SZ-x Cu/Ag反應偶中SZ添加銅的含量超過3wt%時，則Ag-Sn介金屬相將會在界面上生成。SZ-xCu銲料與金基材反應，當無銅添加時界面上生成Au3Zn7、AuZn2和AuZn等三相；當銅的含量?1wt%時，界面上僅有AuZn2與AuZn兩相。銅含量?4wt%時，介金屬相會轉變?Au-Sn二元介金屬相。銅含量增加至7-10wt%時，界面生成(Cu, Au)Sn與AuSn兩層介金屬相。僅有Ni5Zn21相生成於SZ/Au//Ni/SUS 304反應偶。SZ銲料與Alloy 42基材反應則僅生成(Ni, Fe)5Zn21相。