Please use this identifier to cite or link to this item: http://hdl.handle.net/11455/72814
標題: Influence+of+Annealing+Temperature+on+the+Mechanical+Properties+of+Sige+Epitaxial+Thin+Film
退火溫度對矽鍺薄膜機械性質之影響
作者: 戴慶良
張原銘
關鍵字: SiGe thin film;矽鍺薄膜;Residual stress;Young's modulus;Nanoindentation;殘留應力;楊氏係數;奈米壓痕試驗
出版社: 國立中興大學工學院;Airiti Press Inc.
Project: 興大工程學刊, Volume 23, Issue 2, Page(s) 51-57.
URI: http://hdl.handle.net/11455/72814
ISSN: 1017-4397
Appears in Collections:第23卷 第2期
工學院

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