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http://hdl.handle.net/11455/72814| 標題: | Influence+of+Annealing+Temperature+on+the+Mechanical+Properties+of+Sige+Epitaxial+Thin+Film 退火溫度對矽鍺薄膜機械性質之影響 |
作者: | 戴慶良 張原銘 |
關鍵字: | SiGe thin film;矽鍺薄膜;Residual stress;Young's modulus;Nanoindentation;殘留應力;楊氏係數;奈米壓痕試驗 | 出版社: | 國立中興大學工學院;Airiti Press Inc. | Project: | 興大工程學刊, Volume 23, Issue 2, Page(s) 51-57. | URI: | http://hdl.handle.net/11455/72814 | ISSN: | 1017-4397 |
| Appears in Collections: | 第23卷 第2期 工學院 |
Files in This Item:
| File | Size | Format | Existing users please Login |
|---|---|---|---|
| 10174397-201207-201208070006-201208070006-51-57.pdf | 681.83 kB | Adobe PDF | This file is only available in the university internal network |
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