Please use this identifier to cite or link to this item: http://hdl.handle.net/11455/7984
標題: 脈波調變電漿沉積氫化非晶矽薄膜之矽氫組態與多層膜結構研究
Silicon to hydrogen bonding configurations and the multilayers investigate by pulse modulation plasma deposited hydrogenated amorphous silicon thin film
作者: 戴志憲
關鍵字: 脈波調變電漿技術;RETA;矽氫鍵結;多層膜結構
出版社: 電機工程學系
摘要: 
本論文是利用脈波電漿調變技術,控制脈波產生器的RF-on time
,形成不同氫含量和矽氫鍵結結構的薄膜。RF-on time參數分別為30ms ~ 5ms,RF-off time 固定為30ms,在基板溫度100℃、150℃、200℃、SiH4/H2 : 1/4、沉積壓力0.75Torr、功率20W下沉積a-Si:H,經由FTIR光譜儀量測後,可以得到不同參數下對吸收峰值640 cm-1、845 cm-1、890 cm-1、2000 cm-1、2080 cm-1所造成的差異,以及薄膜內氫含量範圍由22.82%至13.52%,了解脈波調變電漿技術和基板溫度對矽氫鍵結組成的影響,再經由UV-VIS-NIR光譜儀和AFM原子力顯微鏡,可得到不同參數下薄膜折射率範圍由3.100 至 3.561,及表面粗糙度範圍由2.365nm 至 0.931nm。
利用快速熱回火技術可以讓薄膜內結構較鬆散的氫先被釋放,得知薄膜內SiH、SiH2、(SiH2)n組成比例,快速熱回火溫度由350℃到650℃經過2+5次、2+5+10次、2+5+10+15次,回火後可得到峰值面積下降百分比640 cm-1、2000 cm-1、2080 cm-1 結果顯示RF-on time越長與溫度越低,結構越鬆散,放氫越多,峰值面積下降百分比越大,RF-on time越短與溫度越高,結構越緻密,放氫越少,峰值面積下降百分比越少。
最後利用脈波調變電漿技術,控制脈波產生器的RF-on time /RF-off time,形成不同氫含量和折射率的薄膜。在利用電腦控制RF-on time/RF-off time和沉積時間,交替沈積製作a-Si:Hx/a-Si:Hy週期結構多層膜、再由XRD繞射光譜儀驗證a-Si:Hx/a-Si:Hy週期結構,是否有符合經由布拉格定律2dsinθ=nλ計算XRD繞射結果要出現的峰值角度。

This thesis uses pulse modulation plasma technology to control the RF-on time of the pulse generator and form the different films on the different hydrogen contents and different Si-H bonding configurations. The a-Si:H films are deposited under the process parameters mentioned after. The RF-on times are set from 30ms to 5ms, the RF-off time is fixed at 30ms. The substrate temperatures are at 100℃, 150℃, 200℃. The ratio of SiH4 to H2 is 1/4, deposition pressure is 0.75 Torr and RF power is 20W. After the measurements of FTIR spectrometer for the a-Si:H films on the different process recipes, we can understand the difference of absorption peaks on 640cm-1 peak, 845 cm-1、890 cm-1、2000 cm-1、2080 cm-1 and the hydrogen contents of films range between 22.82% and 13.52%. Therefore, we the effects of the pulse modulation plasma technology and the substrate temperatures on Si-H bonding configurations. In addition, we get the refractive indices from 3.100 to 3.561 and the surface roughness from 2.365nm to 0.931nm by the measurements and analyses of UV-VIS NIR spectrometer and AFM.
The loose hydrogen structure will be relaxed by using the RETA treatment, and we will analyze the component distribution of SiH、SiH2、(SiH2)n in the films. As the RETA temperatures are set from 350℃ to 650℃ and the annealing cycles are set (2+5) times,(2+5+10) times, and (2+5+10+15) times, we check the change of the area of peak on 640 cm-1、2000 cm-1、2080 cm-1 after RETA annealing. The results show that the structure is looser, the effusion of hydrogen increases, and area of peak decreases. As increasing RF-on time and decreasing the substrate temperature. In contrary, the structure is denser and, the effusion of hydrogen decreases, and area of peak increases. As decreasing RF-on time and increasing the substrate temperature.
Finally, we will form the films on different hydrogen contents and different refractive indices by controlling the ratio of RF-on time to RF-off time of pulse modulation plasma technology. After that, the periodic multi-layer films of alternate a-Si:Hx and a-Si:Hy are fabricated on modulating the RF-on time/RF-off time and deposition time by computer control systems. The periodic a-Si:Hx and a-Si:Hy configurations will be verified by XRD whether the angle of peak of XRD analysis fit the Bragg Law, 2dsinθ=nλ.
URI: http://hdl.handle.net/11455/7984
Appears in Collections:電機工程學系所

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