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標題: An Efficient Metal-Core Printed Circuit Board Witha Copper-Filled Through (Blind) Holefor Light-Emitting Diodes
關鍵字: Light-emitting diodes (LEDs), packaging;thermal resistance
Project: IEEE ELECTRON DEVICE LETTERS, Volume34, Issue 1, Page(s) 105-107.
A Cu-filled through (blind) hole was formed in ametal-core printed circuit board (MCPCB) by drilling a holeunderneath the chip pad, followed by hole filling using copperelectroplating. This Cu-filled through (blind) hole acts as a superiorheat-dissipation route, which directly and efficiently removesthe heat generated by the light-emitting diode (LED) chip. Comparedwith a conventional MCPCB, the MCPCB with a Cu-filledthrough (blind) hole significantly reduces the peak surface temperatureof the LED chip from 46 ◦C to 39 ◦C and the total thermalresistance from 8.9 to 2.8 K/W.
Appears in Collections:化學工程學系所

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