Please use this identifier to cite or link to this item:
|標題:||The cross-interactions in the Ni/Sn/Cu diffusion couples with an electrolesspalladium surface finish||關鍵字:||Diffusion;Electroless Pd;Cross-interaction;Intermetallics||Project:||Journal of Alloys and Compounds, Volume 547, Page(s) 37-42.||摘要:||
Four diffusion couples, Ni/Pd/Sn, Ni/Pd/Sn/Cu, Cu/Pd/Sn, and Cu/Pd/Sn/Ni, were prepared by hot pressingand the interfacial reactions in these multi-layer structures aged at 200 C were investigated. The Pd layer(0.4 and 2 lm) was deposited on the Ni and Cu substrates using electroless plating. The (Pd,Ni)Sn4 phaseformed in the Ni/Pd/Sn diffusion couple grew thicker and dissolved with more Ni atoms upon increasingthe aging time even though the Pd layer was completely consumed. By contrast, the PdSn4 phase formedin the Cu/Pd/Sn diffusion couple exhibited negligible growth with very limited Cu dissolution after the Pdlayer was completely consumed. In the Ni/Pd/Sn/Cu and Cu/Pd/Sn/Ni diffusion couples, the (Cu,Ni)6Sn5phase was formed on the Ni side as a result of the cross-interaction caused by the Cu diffusion fromthe Cu side to the Ni side. With a thicker Pd layer (2 lm), a thicker (Pd,Ni)Sn4 (or PdSn4) phase wasformed in these two diffusion couples and was found to behave as a diffusion barrier. The effect ofcross-interaction due to the Cu diffusion became weaker and as a result the (Cu,Ni)6Sn5 phase formedon the Ni side was gradually transformed into the (Ni,Cu)3Sn4 phase.
|Appears in Collections:||化學工程學系所|
Show full item record
TAIR Related Article
Items in DSpace are protected by copyright, with all rights reserved, unless otherwise indicated.