Please use this identifier to cite or link to this item: http://hdl.handle.net/11455/84856
標題: Characterization of Through-Hole Filling by CopperElectroplating Using a Tetrazolium Salt Inhibitor
Project: Journal of The Electrochemical Society, Volume 160, Issue 12, Page(s) 3028-3034.
摘要: 
Through-hole (TH) filling of an advanced printed circuit board (PCB) by copper electroplating is performed using a direct current(DC) plating method and a simple copper plating formula composed of a single organic additive, namely, nitrotetrazolium bluechloride monohydrate (NTBC). Copper is preferentially deposited at the hole center to form a butterfly-shaped copper cross-sectionin the filled TH during plating. Three key factors are identified for enhancing the filling performance via a center protrusion depositionin the TH and are characterized by practical filling plating results and cyclic voltammetry (CV) analyzes. The filling performance ofthe copper plating formula for the TH is sensitive to forced convection, chloride ion concentrations and H2SO4 concentrations. Anappropriate forced convection combined with weak accelerators [3-(Benzothiazolyl-2-mercapto)-propylsulfonic acid, sodium salt(ZPS) or 3-S-Isothiuronium propyl sulfonate (UPS)] pre-adsorbed on the copper seed layer of the TH can effectively shorten the fillplating time from 9 h to 5 h. The center-protrusion filling mechanism and the role of NTBC in the TH filling are discussed in thiswork based on the plating results and electrochemical analyzes.
URI: http://hdl.handle.net/11455/84856
DOI: 10.1149/2.005312jes
Appears in Collections:化學工程學系所

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