Please use this identifier to cite or link to this item: http://hdl.handle.net/11455/84861
DC FieldValueLanguage
dc.creatorYu-Tien Linen_US
dc.creatorMei-Ling Wangen_US
dc.creatorChia-Fu Hsuen_US
dc.creatorWei-Ping Dowen_US
dc.creatorShih-Min Linen_US
dc.creatorJian-Jun Yangen_US
dc.date2013-09zh_TW
dc.date.accessioned2014-11-25T03:01:59Z-
dc.date.available2014-11-25T03:01:59Z-
dc.identifier.urihttp://hdl.handle.net/11455/84861-
dc.description.abstractThrough-hole (TH) filling of a printed circuit board (PCB) was conducted with a copper electroplating solution. Tetranitrobluetetrazolium chloride (TNBT) was used as an inhibitor and acetic acid electrolyte instead of a traditional H2SO4 electrolyte wasused for the copper electroplating. Moreover, functional insoluble anodes (DT) that were activated with iridium-based mixed metaloxides on Ti meshes were used instead of conventional soluble anodes (i.e., P-doped Cu). The TH filling performance of the copperelectroplating solution was significantly enhanced when acetic acid electrolyte and DT anodes were used simultaneously in thecopper electroplating bath.en_US
dc.format.medium期刊論文zh_TW
dc.language.isoen_USzh_TW
dc.relationJournal of The Electrochemical Society, Volume 160, Issue 12, Page(s) 3149-3153.en_US
dc.relation.urihttp://dx.doi.org/10.1149/2.025312jes-
dc.titleThrough-Hole Filling in a Cu Plating Bath with FunctionalInsoluble Anodes and Acetic Acid as a Supporting Electrolyteen_US
dc.identifier.doi10.1149/2.025312jeszh_TW
item.fulltextno fulltext-
item.languageiso639-1en_US-
item.grantfulltextnone-
Appears in Collections:化學工程學系所
Show simple item record
 

Google ScholarTM

Check

Altmetric

Altmetric


Items in DSpace are protected by copyright, with all rights reserved, unless otherwise indicated.