Please use this identifier to cite or link to this item: http://hdl.handle.net/11455/8796
標題: 應用田口法於雷射開槽參數最適化之探討
The study of the optimization parameters of laser grooving by the application of Taguchi method
作者: 李子明
Li, Tzu-Ming
關鍵字: Taguchi Method;田口法;laser grooving process;metal layer;雷射開槽製程;金屬層
出版社: 電機工程學系所
引用: 參考文獻 [1]http://cdnet.stpi.org.tw/techroom/market/eeic/2010/eeic_10_014.htm,科技產業資訊室-市場報導 [2]http://www.brightekled.com/docf/Reliability.asp,弘凱光電信賴性 [3]李輝煌,”田口方法-品質設計的原理與實務”,高立圖書股份有限公司,台北,2000年 [4] Sillanpaa J,Kangastupa J,Salokatve A.,Asonen H,“Ultra short pulse laser meeting the requirements for high speed and high quality dicing of low-k wafers”,IEEE 2005 [5]Chaware R,Lan Hoang, “Reliability improvement of 90nm large flip chip low-k die via dicing and assembly process optimization”, IEEE 2006 [6] DoHyung Kim , YoonJoo Kim , KyeongSool Seong , JaeKyu Song , BongChan Kim , ChanHa Hwang , ChoonHeong Lee , “Evaluation for UV laser dicing process and its reliability for various designs of stack chip scale package” , IEEE 2009 [7] Koh Wen Shi , Lau Teck Beng , Yow, K.Y , “Laser grooving characterization for dicing defects reduction and its challenges” , IEEE 2009 [8]半導體產業分析及投資機會,經濟部投資業務處,2008年2月 [9] 林三寶,”雷射原理與應用”,全華科技圖書股份有限公司, 1998年 [10] 丁勝懋,”雷射工程導論”,中央圖書出版社, 1993年 [11] 田口玄一,”田口統計解析法=Taguchi''s statistical analysis”,1997年 [12] 游昇鑫,”應用田口方法於球柵陣列封裝之量測參數最佳化設計”,大同大學,碩士論文,2006年 [13]鍾文仁,”以田口方法改善金線偏移之銲線製程問題”,中原大學,碩士論文, 2005年 [14]藍陽瑞,”雷射表面處理改善SUP-9鋼材疲勞壽命之研究”,台灣科技大學,碩士論文,2005年 [15] B.S. Yilbas, “Laser cutting quality assessment and thermal efficiency analysis”, Journal of Materials Processing Technology 155–156 (2004) 2106–2115 [16] M.A. Green, C.M. Chong, F. Zhang, A. Sproul, J. Zolper and S.R. Wenham, “20% EFFICIENT LASER GROOVED”, BURIED CONTACT SILICON SOLAR CELLS, Solar Photovoltaic Laboratory University of New South Wales Kensington, Australia 2033 [17] 張明毅,”田口方法簡介”,宜蘭大學,專題研究,2003年 [18] 丁志華,戴寶通,”田口實驗計畫法簡介”,國家毫微米元件實驗室 [19] 黃乾怡,”田口方法應用於無鉛迴銲製程參數優化”,華梵大學,碩士論文,2007年
摘要: 
今日隨著消費性電子產品在輕薄短小且強大功能的設計需求,晶圓奈米製程中在電晶體結構製程的金屬層上採用強化的高介電值/金屬閘與低電阻/超低介電值銅導線等技術成為目前趨勢。然而,晶圓製造技術的提升也增加了晶圓切割製程的困難度,超低介電值晶圓切割的品質及良率面臨了挑戰。因此,我們針對先進製程晶圓,應用雷射開槽製程來提升晶圓切割的品質。
在本研究為解決雷射開槽中易發生金屬層移除不完全現象,進而探討雷射開槽最適合切割參數,以雷射功率、雷射脈衝頻率、移動速度及失焦距離等重要因子,應用田口法配合雷射開槽機台特性進行實驗,找出提升雷射開槽品質的最適參數。根據實驗結果驗證本研究所建立的參數可有效提升雷射開槽製程品質達10~20%。

Recently, since the design requirement of consumer electronic products is compact and light-weight but multi-functional, it becomes a trend that the use of high-k metal gate and low-resistance copper ultra-low-k interconnect techniques allows advances in the nanometer process. However, this way may increase the difficulty of wafer dicing. It is a challenge to promote wafer dicing quality and yield when using ultra-low-k interconnect techniques. Thus, we employ the laser grooving process as a solution for the advanced process.
The goal of this research is to solve the problem of incomplete removal of metal layers when using the laser grooving process, as well as to find the best dicing parameters by experimenting with an actual laser grooving machine using the Taguchi Method. The factors of laser power, laser pulse frequency, feeder speed, and defocus are examined. The results of experiments verify the parameters proposed in this research can efficiently promote better yields by 10-20 % in the laser grooving process.
URI: http://hdl.handle.net/11455/8796
其他識別: U0005-1008201021165900
Appears in Collections:電機工程學系所

Show full item record
 

Google ScholarTM

Check


Items in DSpace are protected by copyright, with all rights reserved, unless otherwise indicated.