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標題: Unusual Void Formation at the Anode-Side Interface of a Cu/Snagcubi/Cu Solder Stripe under Current Stressing
作者: Shang-Hua Lee
Chih-Fan Lin
Chih-Ming Chen
關鍵字: intermetallic compounds;microstructure;electromigration;diffusion;介金屬化合物;微結構;電遷移;擴散
Project: 興大工程學刊, Volume 24, Issue 1, Page(s) 25-30.
Unusual void formation is found at the anode-side interface of a Cu/solder/Cu stripe under current stressing with a density of 3.0 × 10^4 A/cm^2 at 120℃, where the solder is Sn-3 wt.%Ag-0.5 wt.%Cu added with 10 wt.%Bi. A network structure composed of major Cu6Sn5 particles is formed first at the anode-side interface as a result of Cu dissolution from the cathode-side Cu electrode due to electromigration. This Cu6Sn5 network structure hinders the inward atomic diffusion. Imbalance of atomic fluxes occurs at the anode-side interface, resulting in solder depletion and void formation.

添加10 wt.%鉍的錫-3 wt.%銀-0.5 wt.%銅銲料與兩端的銅電極組成銅/銲料/銅線型樣品,在120℃的溫度下通以3.0 × 10^4 A/cm^2的電流密度,在陽極的銅/銲料界面處發現不尋常的孔洞生成。實驗的觀察顯示,在電遷移影響下,陰極端的銅電極會溶解進入銲料中,並在陽極端的界面處生成大量的Cu6Sn5顆粒,形成一網絡結構,此一網絡結構不利於原子繼續往內擴散,導致原子補充不及,造成原子通量的不平衡,因而在此區域(陽極端的界面)發現銲料消耗與孔洞生成的現象。
Appears in Collections:第24卷 第1期

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