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|標題:||Design and Fabrication of Uniform Temperature Chamber for Integrated Circuits Testing Application
|關鍵字:||handler chamber;uniform temperature;IC testing;分類機腔體;均溫性;積體電路測試||引用:||C. Ciofi, R. Giannetti, and B. Neri, 'True constant temperature measurement system for lifetime tests of Metallic Interconnections of IC's,' IEEE transactions on instrumentation and measurement, vol. 47, pp. 1187-1190, 1998. W. Maly, S. B. Naik, 'Process monitoring oriented IC testing,' International test conference, pp. 527-532, 1989. T.Y .Lin and A.A.O.Tay, 'Influence of temperature, humidity and defect location on delamination in plastic IC packages,' Components and Packaging Technologies, vol. 22, pp. 512-518, 1999. Q. Li, S. Chen, W. Wang, and L. Li, 'An device case temperature closed-loop control system during burn-in test,' Reliability, Maintainability and Safety, pp. 1048-1051, 2011. Q.H. Wang, L.Z. Li, and Z.J. Zhong, 'The new equipment for IC testing,' Solid-State and Integrated Circuit Technology, pp. 532-535, 1998. Z. Dong, Y. Su, and X. Yan, 'Temperature control system of the thermal analyzer based on Fuzzy PID controller,' Ninth International Conference on Hybrid Intelligent Systems , vol. 2, pp. 58-61, 2009. M. Matsunaga, I. Nanno, M. Tanaka, and S. Kawaji, 'A new method of temperature control for the uniform heating,' Industrial Electronics Society, vol. 3, pp. 2097-2102, 2003. I. Nanno, S. Hashida, N. Matsunage ,and S. Kawaji, 'Experimental study on uniform heating control based on temperature difference model,' Mechatronics, pp. 1-6, 2007. S. Hashida, I. Nanno, N. Matsunaga, and S. Kawaji, 'Experimental study on uniform temperature control for two-dimensional heating plate control,' Control, Automation and Systems, pp. 1450-1455, 2007. P. Bratek, A. Kos, 'A method of thermal testing of microsystems,' Microelectronics Reliability , vol. 41, pp. 1877-1887, 2001. D. Gardell, 'Temperature control during test and burn-in,' Inter Society Conference, pp. 635-643, 2002. J. Maveety, M. Malinoski , T. Jones, and S. Knostman, 'A test site thermal control system for at-speed manufacturing testing, ' International test conference, pp. 119-128, 1998. A.C. Pfahnl, J. Lienhard and A. H. Slocum, 'Thermal management and control in testing packaged integrated circuit devices,' 34th intersociety Energy Conversion Engineering conference, No. 1990-01-2723, 1999. A.C. Pfahnl, J. Lienhard, and A.H. Slocum, 'Temperature control of a handler test interface,' Proceedings of the International Test Conference, pp. 114-118, 1998. T. Kitahara , K. Nakai, 'Thermal analysis for high-performance small devices,' Multichip Modules, pp. 96-302, 1997. G. Perry, The fundamentals of digital semiconductor testing, Soft Test, 1999. Epson, NS8000 series high speed IC handler Operation Manual, Seiko Epson Corporation, 2007.  Teradyne, J750 Programming V3.40 Training Manual Module, Teradyne Corporation, 2003. 蔡國忠，ANSYS Workbench 有限元素分析及工程應用，易習電腦圖書公司，2011。 鄭宗杰,余致廣,劉君愷,蔡伯晨,鄭明欣，FC-PBGA 之熱流模擬簡介， 奈米通訊第 11 卷第四期，第 17-21 頁，2004。||摘要:||
The study develops the uniform temperature of handler chamber for the IC (integrated circuits) testing system. The region temperature far away from the heat point in the original IC testing chamber is much lower, and the temperature difference is at least 10 °C between the region and the setting criteria. Therefore, there is a problem of high temperature difference in the original IC testing chamber. It is very important to make a uniform temperature during the IC testing process. The high temperature difference in the chamber results in the erroneous judgment and influences the yield rate of the IC testing. To improve the high temperature difference of the IC testing chamber, we run a testing to change the method of operation by increasing heating time and leading time but failed. Then, we install air blower pipe to increase temperature in the chamber and also install silicon gasket on the docking plate to prevent from temperature drop. The testing results show that the problem of high temperature difference in the chamber is improved. The goal of controlling temperature difference in the chamber has been reached. When handler is set at 100 °C, the test temperature in the chamber is at least 97 °C during the testing of IC. The thermocouples are used to measure the chamber temperature, and the measured results show that the chamber temperature is in the range of 97-100 °C. The finite element method software, ANSYS, is utilized to analyze the chamber temperature. The simulation results of the chamber temperature are agreement with the measurement results. Finally, the improved chamber is applied to the IC testing system, and the yield rate of IC testing enhances from 89 % to 96 %.
本文研究的目的在於探討分類機腔體溫度，在離熱源較遠處溫度會偏低，偏低區域溫度與目標會差距 10 ℃以上，腔體內有溫差過大的問題。在測試流程裡，溫度的測試是相當的重要。在高溫測試的條件下常碰到的問題是首測良率不佳，腔體內溫差過大會導致把積體電路良品測試完誤判成不良品，原因是測試環境下溫度與目標溫度偏差範圍過大所造成。改善腔體溫度溫差過大，透過實驗研究改善，改變作動方式，增加預熱時間與起使等待時間對腔體溫度測試時的偏差並無改善。在硬體裝置上增加熱空氣管來增加熱源與加裝矽膠墊片於結合板上防止熱量流失，腔體內測試環境溫差過大問題已改善，腔體內溫度均溫性目標已達成。在分類機設定 100 ℃時，積體電路上機測試溫度都達 97 ℃以上。放置熱電偶量測腔體內溫度與測試結果吻合，於最低溫處為 97 ℃。透過 ANSYS 軟體分析腔體溫度，模擬腔體內部熱源與條件設定可以減少分析時間。在模擬腔體溫度分佈改善後的狀況與實際溫度結果類似。經過改善過後的腔體裝置測試時，首測良率可已從 89 %提升到 96 %，良率不佳的問題已改善。
|Appears in Collections:||機械工程學系所|
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