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|標題:||Effect of the Phosphor Permanent Substrate on the Angular CCT for White Thin-Film Flip-Chip Light-Emitting Diodes View Document 177||作者:||Ching-Ho Tien
|Project:||IEEE TRANSACTIONS ON ,ELECTRON DEVICES, VOL. 63, NO. 10, OCTOBER 2016||摘要:||
This paper developed a phosphor layer applied for thin-film flip-chip light-emitting diodes (TFFC-LEDs) to produce uniform phosphor-converted TFFC white LEDs (TFFC-WLEDs) by combination of laser liftoff, secondary transferring, and surface roughening process. The spin-coating method was used for phosphor layer fabrication onto a substrate to form the phosphor permanent substrate. The TFFC-LEDs were then bonded onto the permanent substrate. From the results, the blue TFFC GaN-based LED with roughened u-GaN surface on a glass substrate (TFRG-LED) demonstrated a 54.2% (at 350 mA) enhancement in light output power, compared with a blue flip-chip GaN-on-sapphire based LED. As the TFFC GaN/phosphor-/glass-based white LED with roughened u-GaN surface (TFRG-WLED) was operated at a forward-bias current of 350 mA, the enhancement of luminous flux was increased by 75.5%, compared with a TFFC GaN/phosphor template-/glass-based white LED. The angular correlated color temperature (CCT) deviation of a TFRG-WLED can be reduced to 1279 K in the range from -75° to +75° at 5000-6000 K application. The TFRG-WLED was fabricated on the glass substrate with the roughened u-GaN surface and the structure of phosphor layer closed to the u-GaN. These kinds of FRGB-WLED structure contribute to a better light extraction characteristic and a higher CCT stability.
|Appears in Collections:||材料科學與工程學系|
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