Please use this identifier to cite or link to this item: http://hdl.handle.net/11455/97849
標題: 微電子構裝銅/銅直接接合之電鍍組織特徵效應探討
Microstructural Effect of Electrodeposited Copper on Direct Bonding for Microelectronic Assembly
作者: 謝宗育
Zong-Yu Xie
關鍵字: 電鍍;銅對銅接合;奈米雙晶銅;Electropalting Cu;Cu to Cu direct bonding;Nanotwinned Cu
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摘要: 
近年來隨著3D-IC發展成主流趨勢,大量新穎電子產品接連問世,在電子元件的製程中,常見的填入銅導線製程為電鍍法,利於晶片進行縱向矽穿孔堆疊(Through Si via, TSV)。電鍍銅因配方與製程的不同,在硬度、成長方位、晶粒徑與雙晶比例可顯現相當大的差異。本實驗中使用直流電與脈衝電流以及硬銅的添加劑等,製備出三種具不同晶粒特徵電鍍銅膜,於250oC、10MPa進行銅/銅直接壓合,探討組織效應與光照效果。實驗結果顯示,細晶粒、高雙晶比例與表面壓縮殘留應力均有助於直接接合效果。但接點強度仍不如銅表面具伸張殘留應力但晶粒徑小至0.08μm2之濺鍍銅。各種銅試片含電鍍、濺鍍製備者,經Xenon flash表面改質,接合強度均可提升約60%。本研究亦提出以脈衝電鍍製程加上後續光照處理,電鍍銅試片接合強度可較商業配方、具粗大等軸晶者高出129%。

In order to allow conductance between stacked ICs, jointing by metallic connections is necessary. Cu-to-Cu direct bonding is ideal to form required interconnections because copper possesses many advantages, e.g., excellent electrical conductivity, low cost and high electromigration resistance. Electroplating is commonly used to deposit Cu into TSV. Due to ingredient and processing variations, electroplated Cu with differences in hardness, growth orientation, grain size as well as twin boundary fraction can be prepared. In this study, three kinds of electroplated Cu films with various hardnesses and crystal characteristics are deposited and a comparison with sputtered Cu is made. Effects of microstructure and Xenon pulses on directly bonded joint strength are investigated. Experimental results reveal that fine grains, high twin boundary fraction and compressive surface residual stresses are beneficial to thermal compression bonding. However, sputtered Cu with ultra-fine grain (grain size of 0.08 m2) possessed greater joint strength even though the surface stresses are tensile. It is found that subjected to a proper flash pulse exposure, the directly bonded joint strength all kinds of Cu films can be raised by 60%. An optimal process design for electroplated Cu can also be proposed. With pulsed electroplating and following flash irradiation, the joint strength obtained is 129% higher than that of Cu films with coarse equiaxed grains prepared using commercial ingredients.
URI: http://hdl.handle.net/11455/97849
Rights: 同意授權瀏覽/列印電子全文服務,2021-08-27起公開。
Appears in Collections:材料科學與工程學系

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