Please use this identifier to cite or link to this item: http://hdl.handle.net/11455/9797
標題: 錫銦共晶銲料與銅界面反應與接合性質之研究
Interfacial Reactions and Adhesion Strength of Sn-In Eutectic Solder on Copper
作者: 許穎超
Hsu, Ying-Chao
關鍵字: intermetallic compound;介金屬
出版社: 材料工程學研究所
摘要: 
本論文第一部份主要探討Cu/Sn-51wt.%In/Cu在大氣下,溫度範圍180℃~300℃(高於Sn-51wt.%In銲料之熔點120℃),退火30~120分鐘之界面反應,並將重點著重在介金屬之生成、相變化、成份的改變,與動力學成長。主要利用掃描式電子顯微鏡(SEM)與能量散佈光譜儀(EDS)進行金屬界面反應之研究,發現Cu/Sn-51wt.%In/Cu在180℃、240℃與300℃退火30~120分鐘皆會形成以錫原子部分取代銦原子的Cu11In9介金屬型態出現,或是以銦原子部分取代錫原子的Cu6Sn5介金屬化合物。在240℃退火90分鐘後,發現介穩相之短柱狀Cu3In5Sn2介金屬化合物。而在300℃下退火則發現第二層介金屬層推測其為銦與錫原子互相取代之Cu3Sn介金屬相。經計算介面處介金屬之平均生成活化能為22.4kJ/mol。
第二部份則探討Cu/Sn-51wt.%In/Cu結構在180℃、240℃與300℃熱壓接合30~120分鐘後,溫度與時間對機械性質之影響。發現接合強度隨時間與溫度之增加而增加,強度最高可達19MPa。在低溫或短時間熱壓接合後試片經拉伸具有二種破壞模式,分別為延性破裂與脆性破裂。隨溫度與時間的增加破壞模式轉變為延性破裂。在高溫或長時間下,其破斷模式又轉換成脆性破壞模式。

The first part of this study is to investigate the interfacial reactions of the Cu/Sn-51wt%In/Cu sandwiched structure annealed from 180℃ to 300℃ (higher than the melting point of Sn-In eutectic solder, 120℃). Characterization of the phase formation at the eutectic solder/Cu interfaces was carried out by scanning electron microscopy (SEM) and energy-dispersive spectroscopy (EDS). It is found that the Cu6(In, Sn)5 or Cu11(In, Sn)9 intermetallic compound appears at all annealing temperature. The Cu3In5Sn2 short pillar intermetallic compound present in the specimens heat-treated at 240℃for 90, 120min and 300℃for 30, 60min. The Cu3(In, Sn) intermetallic compound is observed in the specimen annealed at 300℃. The growth of the intermetallic compounds has an activation energy of 22.4 KJ/mol at temperature ranging from 180℃ to 300℃.
The second part of this study is to investigate the effects of annealing temperature and time on the adhesion strength of the Cu/Sn-51wt%In/Cu sandwiched structure. The adherence of the sandwiched specimens was evaluated by a single-lap tensile test; the highest adhesion strength is obtained to be 19 MPa for the specimen heat-treated at 300℃ for 120min. It is found that the adhesion strength increases with increasing temperature and time. A mixed ductile and brittle fracture was observed for specimens joined at low temperature and short time. By increasing the joining time and temperature, the fracture mode changes from the mixed mode to a ductile fracture. At higher joining temperature and longer time, the fracture of the specimens becomes brittle mode again.
URI: http://hdl.handle.net/11455/9797
Appears in Collections:材料科學與工程學系

Show full item record
 

Google ScholarTM

Check


Items in DSpace are protected by copyright, with all rights reserved, unless otherwise indicated.