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標題: 錫銦共晶銲料與銅界面反應與接合性質之研究
Interfacial Reactions and Adhesion Strength of Sn-In Eutectic Solder on Copper
作者: 許穎超
Hsu, Ying-Chao
關鍵字: intermetallic compound;介金屬
出版社: 材料工程學研究所

The first part of this study is to investigate the interfacial reactions of the Cu/Sn-51wt%In/Cu sandwiched structure annealed from 180℃ to 300℃ (higher than the melting point of Sn-In eutectic solder, 120℃). Characterization of the phase formation at the eutectic solder/Cu interfaces was carried out by scanning electron microscopy (SEM) and energy-dispersive spectroscopy (EDS). It is found that the Cu6(In, Sn)5 or Cu11(In, Sn)9 intermetallic compound appears at all annealing temperature. The Cu3In5Sn2 short pillar intermetallic compound present in the specimens heat-treated at 240℃for 90, 120min and 300℃for 30, 60min. The Cu3(In, Sn) intermetallic compound is observed in the specimen annealed at 300℃. The growth of the intermetallic compounds has an activation energy of 22.4 KJ/mol at temperature ranging from 180℃ to 300℃.
The second part of this study is to investigate the effects of annealing temperature and time on the adhesion strength of the Cu/Sn-51wt%In/Cu sandwiched structure. The adherence of the sandwiched specimens was evaluated by a single-lap tensile test; the highest adhesion strength is obtained to be 19 MPa for the specimen heat-treated at 300℃ for 120min. It is found that the adhesion strength increases with increasing temperature and time. A mixed ductile and brittle fracture was observed for specimens joined at low temperature and short time. By increasing the joining time and temperature, the fracture mode changes from the mixed mode to a ductile fracture. At higher joining temperature and longer time, the fracture of the specimens becomes brittle mode again.
Appears in Collections:材料科學與工程學系

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