Please use this identifier to cite or link to this item: http://hdl.handle.net/11455/98390
標題: 車用高功率 LED 頭燈散熱模型之模擬分析
Heat Dissipation Model of a High-Power LED Headlamp for the Automobile
作者: 林俊睿
Chun-Jui Lin
關鍵字: 高功率 LED 頭燈;熱管;風扇;接面溫度;ANSYS Fluent;High Power LED headlamp;heat pipe;fan;junction temperature;ANSYS Fluent
引用: [1] A. S. Kuznetsov, V. K. Tikhomirov, M. V. Shestakov and V. V. Moshchalkov, 'Ag nanocluster functionalized glasses for efficient photonic conversion in light sources, solar cells and flexible screen monitors,' Nanoscale, vol. 5, no. 21, pp. 10065-10075, 2013. doi:10.1039/C3NR02798H [2] N. Narendran, Y. Gu, J. P. Freyssinier, H. Yu, L. Deng, 'Solid-state lighting: failure analysis of white LEDs,'Journal of Crystal Growth, vol. 268, pp. 449- 456, 2004. doi: 10.1016/j.jcrysgro.2004.04.071. [3] CREE, 'Cree® XLamp® XHP70 LEDs,' Product family data sheet, 2014- 2017, http://www.cree.com [4] 弘凱光電股份有限公司,http://www.brightekled.com/ [5] 集邦科技(TrendForce),http://www.ledinside.com.tw/ [6] M. Arik, J. Petroski, S. Weaver, 'Thermal challenges in the future generation solid state lighting applications: light emitting diodes,' Conference: Thermal and Thermomechanical Phenomena in Electronic Systems, ITHERM 2002. doi: 10.1109/ITHERM.2002.1012446. [7] Philips Lumileds Lighting, U.S. LLC., 'Power Light Source LUXEON III Emitter', Technical Datasheet DS45,www.lumileds.com [8] 李龍育,高功率 LED 汽車頭燈散熱設計之模擬與實驗整合研究,國立臺灣科技大學機械工程系,碩士論文,2008。 [9] CREE, 'Thermal Management of Cree® XLamp® LEDs,' Application Note, 2012-2017, http://www.cree.com [10] Amir Faghri, HEAT PIPES: REVIEW, OPPORTUNITIES AND CHALLENGES, Frontiers in Heat Pipes (FHP) 5 – 1, 2014. DOI: doi:10.5098/fhp.5.1, ISSN: 2155-658X. [11] M. Arik and S. Weaver, 'Chip Scale Thermal Management of High Brightness LED Packages,' Proc. of SPIE Vo1. 5530, pp. 214-223, 2004. doi:10.1117/12.566061 [12] M. W. Shin, 'Thermal Design of High-Power LED Package and System,' Proc. Of SPIE Vo1. 635509, pp. 1-13, 2006. doi:10.1117/12.690928. [13] N. Narendran, 'Long-term performance of white LEDs and systems,' Proceeding of First international Conference on White LEDs and Solid State Lighting, Tokyo, Japan, pp. 174-179, 2007. [14] K. C. Yung, H. Liem, H. S. Choy, W. K. Lun, 'Thermal performance of high brightness LED array package on PCB,' International Communications in Heat and Mass Transfer, vol. 37, pp. 1266-1272, 2010. [15] Faghri, A., 1994, 'Centrifugal Heat Pipe System,' U.S. Patent No.5297619. [16] Faghri, A., 1995, Heat Pipe Science and Technology, 1st ed., Taylor & Francis, Washington, D.C. [17] J. E. Deverall and J. E. Kemme, 'Satellite Heat Pipe,' USAEC Report LA- 3278, Contract W-7405-eng-36, Los Alamos Scientific Laboratory, University of California, 1970. [18] Perkins, J., 1836, UK Patent No. 7059. [19] Anonymous, 'The Paris Exhibition – Perkins' Portable Oven,' The Engineer, pp. 519, 1867. [20] Gaugler, R., 1944, 'Heat Transfer Device,' U.S. Patent No. 2350348. [21] Grover, G., 1966, 'Evaporation-Condensation Heat Transfer Device,' U.S. Patent No. 3229759. [22] Grover, G. M., Cotter, T. P., and Erickson, G. F., 1964, 'Structures of very High Thermal Conductance,' Journal of Applied Physics, 35(6), 1990- 1991.DOI: 10.1063/1.1713792. [23] T. P. Cotter, 'Theory of Heat Pipes,' Los Alamos Scientific Laboratory Report No. LA-3246-MS, 1965. [24] T. P. Cotter, Principles and Prospects for Micro Heat Pipes. Proceedings of the 5th International Heat Pipe Conference, Tsukuba, 328-335, 1984. [25] G. A. Asselman and D. B. Green, 'Heat Pipes,' Phillips Technical Review, Vol. 16, pp. 169-186, 1973. [26] H. Kozai, 'The Effective Thermal Conductivity of Screen Wick,' Proc. 3rd Int. Heat Pipe Symposium, Tsukuba. Japan Association for Heat Pipe, 1988. [27] J. C. Maxwell, 'A Treatise on Electricity and Magnetism,' vol. 1, 3rd Edn. OUP(1981), 1954. [28] I. Sauciuc, M. Mochizuki, K. Mashiko, Y. Saito, T. Nguyen, 'The Design and Testing of the Super Fiber Heat Pipes for Electronics Cooling Applications,' Semiconductor Thermal Measurement and Management Symposium. Sixteenth Annual IEEE, 2000. DOI:10.1109/STHERM.2000.837058 [29] J. Legierski, B. Wiecek and A. D. Mey, 'Measurements and Simulations of Transient Characteristics of Heat Pipes', Microelectronics Reliability, vol. 46, pp. 109-115, 2006. [30] X. Y. Lu, T. C. Hua, M. J. Liu and Y. X. Cheng, Thermal analysis of loop heat pipe used for high-power LED, Thermochim. Acta, vol. 493, Issues 1–2, 2009, pp 25–29, 2009. DOI:10.1016/j.tca.2009.03.016 [31] 徐國懷,填充量與真空度對熱管最大熱傳量之影響,國立清華大學工程與系統科學研究所,碩士論文,2011 年。 [32] M. Mochizuki, Y. Saito, K. Goto, and T. Nguyen, 'Hinged Heat Pipe for Cooling Notebooks PCs,' IEEE SEMI-THERM Symposium, pp. 64-72, 1997. [33] T. Nguyen, M. Mochizuki, K. Mashiko, Y. Saito, I. Sauciuc, R. Boggs, 'Advanced Cooling System Using Miniature Heat Pipes in Mobile PC,' IEEE Transactions on Components and Packaging Technology, Vol. 23, No. 1, pp. 86-90, 2000. [34] K. S. Kim, ' Heat pipe cooling technology for desktop PC CPU,' Applied Thermal Engineering, vol. 23, pp. 1137-1144, 2003. [35] 呂孟恭,熱管散熱模組應用於繪圖處理器系統測試散熱模擬與設計,國立高雄應用科技大學模具工程系,碩士論文,2012 年。 [36] 林顯群、李龍育、鄭光廷、顏則修、張光仁,高功率 LED 應用於機車頭燈上之散熱設計,第 11 屆車輛工程學術研討會,2006 年。 [37] 蕭飛賓、江志煌,高功率 LED 模組應用於汽車適路性頭燈系統之熱傳分析與設計,中國機械工程學會第 23 屆全國學術研討會論文集,2006 年。 [38] 李龍育,高功率 LED 汽車頭燈散熱設計之模擬與實驗整合研究,國立台灣科技大學機械工程研究所,碩士論文,2008 年。 [39] E. D. Jung, Y. L. Lee, 'Study on the Development of LED Headlamps for Used Cars,' Transactions on Electrical and Electronic Materials, vol. 15, no. 5, pp. 270-274, 2014. [40] E. D. Jung, Y. L. Lee, 'Development of a heat dissipating LED headlamp with silicone lens to replace halogen bulbs in used cars,' Applied Thermal Engineering, vol. 86, pp. 143-150, 2015. [41] 林瑞晟,熱管在 LED 上之應用,國立中央大學光電科學與工程學系,碩士論文,2015 年。 [42] 陳建宏,以田口法優化 LED 車燈散熱系統之研究,國立中央大學光電科學與工程學系,碩士論文,2015 年。 [43] 江岳穎,白光發光二極體之投射式近光汽車頭燈設計,國立成功大學工程科學系,碩士論文,2015 年。 [44] C. Xiao, H. Liao, Y. Wang, J. Li, W. Zhu, 'A novel automated heat-pipe cooling device for high-power LEDs,' Applied Thermal Engineering, vol. 111, pp. 1320–1329, 2017. [45] F. P. Incropera, D. P. DeWitt, T. L. Bergmann and A. S. Lavine, Fundamentals of Heat and Mass Transfer, 6th Edition., Wiley. ISBN-13: 978-0471457282. [46] 璦司柏電子股份有限公司,http://www.icprotect.com.tw/index.html [47] CREE, 'Optimizing PCB Thermal Performance for Cree® XLamp® LEDs', Application Note, 2012-2017, http://www.cree.com [48] 蔡良德,車用高功率LED 頭燈散熱機構設計之模擬分析,國立中興大學精密工程研究所,碩士論文,2017年。 [49] 竣丞國際有限公司,http://www.jc-heatpipe.com/index.html [50] S. V. Patankar and D. B. Spalding, 'A Calculation Procedure for Heat Mass and Momentum Transfer in Three-Dimensional Parabolic Flows', International Journal of Heat Mass Transfer, Vol.15, pp. 1787-1806, 1972. [51] ANSYS,http://www.ansys.com/zh-TW. [52] 北京兆迪科技有限公司,ANSYS Worbench 14.0 結構分析快速入門進階與精通,電子工業出版社。 [53] Fluent 6.2 User's Guide, Fluent Inc., 2005. [54] 虎門科技股份有限公司,http://www.cadmen.com/
摘要: 
隨著 LED 封裝製程能力進步與成本逐漸降低,並擁有高效率、壽命長, 輕薄短小、造型設計容易等諸多優勢,近幾年被廣泛的應用在汽車照明光源的使用,並開始往替代舊式鹵素燈與氙氣頭燈來設計發展,成為未來市場上各家製造商積極研究之目標。但由於 LED 本身的發光效率及壽命,將會隨著晶片溫度的升高而遞減,以及 LED 的封裝結構並不耐熱,當 LED 晶片的接面溫度過高時,將會對晶片本身與封裝的材料帶來永久性的傷害。因此如何設計出有效的散熱方式,以提升 LED 發光效率及壽命,將是高功率 LED 上應用的重要關鍵。
本研究利用計算流體分析軟體,針對市售高功率 LED 頭燈之原始模型進行分析與散熱設計。透過加入溝槽式熱管與風扇,以及改變 LED 封裝基板與電路板材質參數,觀察 LED 晶片接面溫度的變化,探討散熱模組之散熱效益。結果顯示,在原始參考模型外觀尺寸不變下,在強制對流下透過加入熱管與提高 LED 散熱基板及 PCB 之熱傳係數,可有效使 LED 晶片接面溫度降低,使高功率 LED 頭燈在安全溫度範圍內,保持元件可靠度。

With the improvement of LED packaging process capability and cost, and the advantages of high efficiency, long life, light and short, easy to design, etc., it has been widely used in automotive lighting sources in recent years, and has begun to replace the old halogen. The design and development of lamps and xenon headlamps has become the goal of active research by various manufacturers in the market in the future. However, due to the luminous efficiency and lifetime of the LED itself, it will decrease as the temperature of the wafer increases, and the package structure of the LED is not heat-resistant. When the junction temperature of the LED chip is too high, the wafer itself and the package tape will be come to permanent damage.Therefore, how to design an effective heat dissipation method to improve the LED luminous efficiency and life will be an important key to the application of high power LEDs.
This study used computational fluid analysis software to analyze and heat-dissipate the original model of commercially available high-power LED headlamps. By adding the grooved heat pipe and the fan, and changing the material parameters of the LED package substrate and the circuit board, the change of the junction temperature of the LED chip is observed, and the heat dissipation efficiency of the heat dissipation module is discussed. The results show that under the forced convection, the heat transfer coefficient of the LED heat sink substrate and the PCB can be effectively reduced under the forced convection, so that the junction temperature of the LED chip can be effectively lowered, and the high-power LED headlight is safe. Maintain component reliability over temperature.
URI: http://hdl.handle.net/11455/98390
Rights: 同意授權瀏覽/列印電子全文服務,2022-01-25起公開。
Appears in Collections:精密工程研究所

Files in This Item:
File SizeFormat Existing users please Login
nchu-108-5105067003-1.pdf5.21 MBAdobe PDFThis file is only available in the university internal network    Request a copy
Show full item record
 

Google ScholarTM

Check


Items in DSpace are protected by copyright, with all rights reserved, unless otherwise indicated.