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標題: 溫度負載對於先進封裝微凸塊之剪切強度研究
Investigation of Shear Strength for the Microbump of Advanced Packages under Temperature Loads
作者: 蔡筑涵
Chu-Han Tsai
關鍵字: 微凸塊;銅柱;溫度負載;剪切力;有限元素分析;microbump;copper pillar;temperature load;shear force;finite element
引用: [1] 江國寧,'微電子系統封裝基礎理論與應用技術',滄海書局,2006. [2] Y. Huang, Z. Xiu, G. Wu, Y. Tian, P. He, X. Gu, and W. Long ,'Improving Shear Strength of Sn-3.0Ag-0.5Cu/Cu Joints and Suppressing Intermetallic Compounds Layer Growth by Adding Graphene Nanosheets,' Materials Letters, Vol. 169, pp. 262-264, 2016. [3] A. S. M. A. Hasee, M. M. Arafat, and M. R. Johan,'Stability of Molybdenum Nanoparticles in Sn–3.8Ag–0.7Cu Solder During Multiple Reflow and Their Influence on Interfacial Intermetallic Compounds,' Materials Characterization, Vol. 64, pp. 27-35, 2012. [4] S. M. L. Nai, J. Wei, M. Gupta,'Interfacial Intermetallic Growth and Shear Strength of Lead-Free Composite Solder Joints,' Journal of Alloys and Compounds, Vol. 473, no.1-2, pp. 100-106, 2009. [5] B. Guo, A. Kunwar, N. Zhao, J. Chen, Y. Wang, and H. Ma ,'Effect of Ag3Sn Nanoparticles and Temperature on Cu6Sn5 IMC Growth in Sn-xAg/Cu Solder Joints,' Materials Research Bulletin, Vol. 99, pp. 239-248, 2018. [6] A. S. M. A. Haseeb, T. S. Leng,'Effects of Co Nanoparticle Addition to Sn–3.8Ag–0.7Cu Solder on Interfacial Structure after Reflow and Ageing,' Intermetallics, Vol. 19, no.5, pp. 707-712, 2011. [7] W. Y. Chen, R. W. Song, and J. G. Duh,'Grain Structure Modification of Cu-Sn IMCs by Applying Cu-Zn UBM on Transient Liquid-Phase Bonding in Novel 3D-IC Technologies,' Intermetallics, Vol. 85, pp. 170-175, 2017. [8] S. L. Tay, A. S. M. A. Haseeb, M. R. Johan, P. R. Munroe, and M. Z. Quadir,'Influence of Ni Nanoparticle on the Morphology and Growth of Interfacial Intermetallic Compounds between Sn–3.8Ag–0.7Cu Lead-Free Solder and Copper Substrate,' Intermetallics, Vol. 33, pp. 8-15, 2013. [9] Y. Tang, G. Y. Li, and Y. C. Pan,'Influence of TiO2 Nanoparticles on IMC Growth in Sn–3.0Ag–0.5Cu–xTiO2 Solder Joints in Reflow Process,' Journal of Alloys and Compounds, Vol. 554, pp. 195-203, 2013. [10] B. L. Chen, and G. Y. Li,'Influence of Sb on IMC Growth in Sn–Ag–Cu–Sb Pb-Free Solder Joints in Reflow Process,' Journal of Alloys and Compounds, Vol. 462-463, pp. 395-401, 2004. [11] B. S. Lee, and S. B. Jung, J. W. Yoon,'Enhancement of Cu Pillar Bumps by Electroless Ni Plating,' Microelectronic Engineering, Vol. 180, pp. 52-55, 2017. [12] A. Syed, K. Dhandapani, R. Moody, L. Nicholls, and M. Kelly,'Cu Pillar and μ-bump Electromigration Reliability and Comparison with High Pb, SnPb, and SnAg bumps,' in 2011 IEEE 61st Electronic Components and Technology Conference (ECTC), May 31- Jun 3, pp. 332-339, 2011. [13] Y. J. Chen, C. K. Chung, C. R. Yang, and C. R. Kao, 'Single-Joint Shear Strength of Micro Cu Pillar Solderbumps with Different Amounts of Intermetallics,' Microelectronics Reliability, vol. 53, pp. 47-52, 2013. [14] H. Lee, S. S. Wong, and S. D. Lopatin,'Correlation of Stress and Texture Evolutionduring Self- and Thermal Annealing of Electroplated Cu Films,' Journal of Applied Physics, Vol. 93, No. 7, pp. 3796-3804, 2003. [15] K.W. Chen, L.H. Hsu, J.K. Huang, Y.L. Wang, and K.Y. Lo,'A Strategic Copper PlatingMethod Without Annealing Process,' Journal of The Electrochemical Society, Vol. 156, No. 10, pp. 448-451, 2009. [16] J. Torres,'Advanced Copper Interconnections for Silicon CMOS Technologies,' Applied Surface Science, Vol. 91, No. 1-4, pp. 112-123, 1995. [17] M. Genanu, F. Mutuku,'Microstructure and Performance of Micro CU Pillars Assemblies,' in SMTA International Conference Proceedings, Sep 25-29, pp. 75-82, 2016. [18] L. C. Kao, L. H. Hsu, S. Brahma, B. C. Huang, C. C. Liu, and K. Y. Lo,'Stabilized copper plating method by programmed electroplated current: Accumulation of densely packed copper grains in the interconnect,' Applied Surface Science, Vol. 388, pp. 228-233, 2016. [19] JEDEC,'Solder Ball Shear,' vol. JESD22-B117B, ed:JEDEC Solid State echnology Association, May, pp. 22, 2014 [20] J. Y. HonChia, B. Cotterell, and T. C. Chai,'The Mechanics of the Solder Ball Shear Test and the Effect of Shear Rate,' Materials Science and Engineering: A, Vol. 417, pp. 259-274, 2006. [21] X. Huang, S. W. R. Lee , C. C. Yan , and S. Hui ,'Characterization and Analysis on the Solder Ball Shear Testing Conditions,' in Proc. Electronic Components and Technology Conference, May 29-June 1, pp. 1065-1071, 2001. [22] X. Huang , S.-W.R. Lee , and C. C. Yan ,'Experimental Investigation on the Progressive Failure Mechanism of Solder Balls During Ball Shear Test,' in Proc. Electronic Components and Technology Conference, May 28-31, pp. 968-973, 2002. [23] M. C. Yew , C. Y. Chou , and K. N. Chiang ,'Reliability Assessment for Solders with A Stress Buffer Layer Using Ball Shear Strength Test and Board-Level Finite Element Analysis,' Microelectronics Reliability, Vol. 47, no.9-11, pp. 1658-1662, 2007. [24] X. Zhang, E. H. Wong, C. Lee , T. C. Chai, Y. Ma, P. S. Teo, D. Pinjala , and S. Sampath,'Thermo-Mechanical Finite Element Analysis in A Multichip Build up Substrate Based Package Design,' Microelectronics Reliability, Vol. 44, no.4, pp. 611-619, 2004. [25] C. C. Lee, K. S. Kao, R. S. Cheng, C. J. Zhan, and T. C. Chang,'Reliability Enhancements of Chip-on-Chip Package with Layout Designs of Microbumps,' Microelectronic Engineering, Vol. 120, pp. 138-145, 2014. [26] D. W. Kim, and B. S. Kong,'The Effect of Hygro-Mechanical and Thermo-Mechanical Stress on Delamination of Gold Bump,' Microelectronics Reliability, Vol. 46, no.7, pp. 1087-1094, 2006. [27] Y. Tang, S. M. Luo, G. Y. Li, Z. Yang, R. Chen, Y. Han , and C. J. Hou,'Optimization of the Thermal Reliability of a Four-Tier Die-Stacked SiP Structure Using Finite Element Analysis and the Taguchi method,' Microelectronics Journal, Vol. 73, pp. 18-23, 2018. [28] K. C. Chang, and K. N. Chiang,'Improvements of Solder Ball Shear Strength of a Wafer-Level CSP Using a Novel Cu Stud Technology,' IEEE Transactions on Components and Packaging Technologies, Vol. 27, no.2, pp. 373-382, 2004. [29] K. N. Chiang, and C. A. Yuan,'An Overview of Solder Bump Shape Prediction Algorithms with Validations,' IEEE Transactions on Advanced Packaging, Vol. 24, no.2, pp. 158-162, 2001. [30] Z. H. Zhong, Finite Element Procedures for Contact-Impact Problems, Oxford University Press, New York, 1993. [31] R. C. Chang, and S. Y. Jhan, Nonlinear Finite Element Analysis, Chongqing University Press, Chongqing, 1990. (in Chinese) [32] T. Belytschko, W. K. Liu, and Moran, B., Nonlinear Finite Elements for Continua and Structures, 1st ed, John Wiley & Sons, New York, 2000. [33] F. P. Beer, and E. R. Johnston, Mechanics of Materials, McGraw-Hill, New York, 2002. [34] C. C. Yang, C. Witt, P. C. Wang, D. Edelstein, and R. Rosenberg,'Stress control during thermal annealing of copper interconnects,' Applied Physics Letters, Vol. 98, No. 5, pp. 051911, 2011. [35] D. Gan, P. Ho, R. Huang, J. Leu, J. Maiz, and T. Scherban, 'Isothermal stress relaxation in electroplated Cu films. I. Mass transport measurements', Journal of Applied Physics, vol. 97, no. 10, pp. 103531, 2005. [36] B. Z. Hong, and L. S. Su,'On Thermal Stresses and Reliability of a PBGA Chip Scale Package,' in Proceedings of 48th IEEE Electronic Components and Technology Conference, pp. 503-510, May 25-28, 1998. [37] D. E. Riemer,'Prediction of Temperature Cycling Life for SMT Solder Joints on TCE-Mismatched Substrates,' in Proceedings of 40th IEEE Electronic Components and Technology Conference, pp. 418-425, May 20-23, 1990. [38] C. C. Lee, T. F. Yang, K. S. Kao, R. C. Cheng, C. J. Zhan, and T. H. Chen, 'Development of Cu/Ni/SnAg Microbump Bonding Processes for Thin Chip-on-Chip Packages Via Wafer-Level Underfill Film,' IEEE Transactions on Components, Packaging and Manufacturing Technology, Vol. 2, no. 9, pp. 1412–1419, 2012.

The development of technology is miniaturization and lightweight, and the scale of the package has gradually narrowed to the micron level. In recent years, the flip chip structure has developed the copper pillar bump structure from the traditional solder ball, due to the copper pillar bump has a higher density than solder ball in the same area, and copper pillar bump's height can be controlled easilier. Therefore, the copper pillar bump has begun to be mass-produced afterwards. However, the strength of the solder joints in the package is very important for the reliability of the overall structure. One of the most important factors is temperature. Shear test is the most widely method to be used to evaluate solder joint strength. This study will explore the shear strength for the microbump under temperature loads.
In this study, high temperature experiments and high temperature storage aging were performed at different temperatures. Due to the higher temperature, microbump's material will be soften, and the shearing force tends to be smaller. During high temperature storage aging, as the baking time increases, the residual stress of the copper pillar will be released, and enhance the strength of the bump at first, and then the strength decreases due to grain growth. Therefore, the shear force of the copper pillar first rises and then falls. In addition, this study also uses finite element analysis as the push ball simulation, and the stress and strain are concentrated on both sides of the pad.Thay's the weakest part of the whole structure. When the adhesive strength between the materials is weak, it will fracture from there. In order to save the development costs, finite element analysis can be used as a reference for future microbump structure design.
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