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|標題:||Studies on Microjoints and Microstructure for the Eutectic alloy of In-Sn-Ag in Ni
|關鍵字:||Lead-less solder;無鉛銲錫;Eutectic alloy;Solid/ liquid diffusion joint;共晶合金;固液擴散接合;電子顯微鏡;介金屬||出版社:||材料工程學研究所||摘要:||
本研究係以無鉛銲錫之低熔點金屬合金為對象，探討高熔點金屬鎳，浸鍍於低熔點金屬銀-錫及銀-銦共晶合金熔湯之固-液擴散反應機構，並求得其界面反應動力學。由於高熔點金屬會和低熔點金屬合金形成介金屬(Intermetallic)化合物，經由相互的「固態擴散反應」(solid state interdiffusion reaction)或「固液擴散反應」(solid-liquid interdiffusion reaction)形成高熔點的介金屬化合物 (intermetallic compounds) 並完全取代原有之低熔點合金。研究內容包括界面反應、微結構分析、接合機械性質等。
研究結果顯示：（1）經TEM、XRD及SEM分析，反應生成相在鎳/純銦熱蒸鍍薄膜系統為 Ni10In27和Ni2In3等相，平均剪應力為 8.1 MPa；在鎳/純錫熱蒸鍍薄膜系統為Ni3Sn4和Ni3Sn2等相，平均剪應力為 143.3 MPa。(2)鎳/純銦經300℃-500℃熱浸反應後，以EDS, XRD分析，所產生的介金屬相有Ni10In27及Ni2In3介金屬相。鎳/純銦銲錫熱浸反應系統可得到最大剪應力為7.6 MPa，其反應活化能Q=31.6 kJ/mol；在300℃~500℃鎳/純錫銲錫熱浸反應系統，以EDS分析，結果僅出現Ni3Sn4介金屬相，但利用XRD分析可得到Ni3Sn4和Ni3Sn2等相。其最大剪應力為71.5 MPa，其反應活化能在350℃~500℃為35.45 kJ/mol。(3)鎳/共晶銦銀銲錫熱浸反應系統經300℃-500℃熱浸反應後，以EDS, XRD分析，所產生的介金屬只發現Ni10In27及Ni2In3介金屬相，最大剪應力為36.3 MPa，其反應活化能Q=29.3 kJ/mol；而在300℃~500℃之鎳/共晶錫銀銲錫熱浸反應系統，以EDS及XRD分析結果則僅出現Ni3Sn4介金屬相，其最大剪應力為85.2 MPa，其反應活化能在300℃~500℃為39.1 kJ/mol。(4)利用歐傑電子分析儀(AES)，分析鎳/共晶錫銀及鎳/共晶銦銀銲錫固態擴散反應形成之介金屬結構表面，結果所偵測到之銀訊號相當微弱，所以在本實驗研究中鎳只和銦或錫元素鍵結形成Ni10In27與Ni3Sn4等介金屬相。(5)介金屬化合物都屬脆性，硬度值皆非常高，本實驗以微小硬度機所測得之硬度達Hv(0.2/30)400以上。另外介金屬結構物的機械性質受其微結構及反應生成相所控制，而微結構及界面反應又受接合條件如溫度、時間、接合壓力所影響。
The studied of this thesis was focus on low melting alloy of lead-less solder. To discuss the reaction mechanism between high melting point nickel and low melting point eutectic alloy of silver-tin, silver-indium interface. Since intermetallic compounds were formed between high melting point metals and low melting point alloys interface, that the interface reactions, micro-structure, and interface adhesion properties could be studies by the methods of solid state interdiffusion and solid-liquid interdiffusion.
The results in our studies: (1) From transmission electron microscope (TEM), x-ray diffraction (XRD), and scanning electron microscope (SEM) analyses, the results displayed Ni10In27 and Ni2In3 phases forming at Ni/In interface whose average interface shear stress was 8.1 Mpa, Ni3Sn4 and Ni3Sn2 phases forming at Ni/Sn interface whose average shear stress was 143.3 Mpa. (2) There are Ni10In27 and Ni2In3 phases using XRD and energy dispersive spectrometer (EDS) were formed at Ni/In interface when temperature between 300oC and 500 oC. Moreover, the maximum interface shear stress was 7.6 Mpa and activation energy was 31.6 kJ/mol. At the Ni/Sn interfaces, Ni3Sn4 phase could only be observed by EDS, compared with EDS analysis Ni3Sn4 and Ni3Sn2 could be observed by XRD at temperature between 300oC and 500oC. Moreover, the maximum interface shear stress was 71.5 Mpa and activation energy was 35.45 kJ/mol. (3) There are Ni10In27 and Ni2In3 phases using XRD and EDS were formed in Ni/ eutectic In-Ag interface when temperature between 300oC and 500 oC. Moreover, the maximum interface shear stress was 36.3 Mpa and activation energy was 29.3 kJ/mol. However, Ni3Sn4 phase using EDS and XRD could only be observed at temperature between 300oC and 500oC in Ni/ eutectic Sn-Ag interface. Moreover, the maximum interface shear stress was 85.2 Mpa and activation energy was 39.1 kJ/mol. (4) Using auger electron spectroscopy (AES) analyses, that signal of Ag element was hardly detected from the interfaces of Ni/eutectic Sn-Ag, and Ni/eutectic In-Ag, therefore in our studies that Ni10In27, and Ni3Sn4 phases were easy formed from the bonding Ni to In or Sn elements. (5) The intermetallic compounds are brittle and hard, in our studied hardness of the compounds was higher than 400 MHv. In addition, mechanical properties of intermetallic compounds were controlled by microstructure and reaction phases, in other words, microstructure and reaction phase were controlled by temperature, reaction time, and joint pressure conditions.
|Appears in Collections:||材料科學與工程學系|
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