Please use this identifier to cite or link to this item: http://hdl.handle.net/11455/99202
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dc.contributor.authorChien Han Chenzh_TW
dc.contributor.authorZu Ciang Guzh_TW
dc.contributor.authorYi Lin Tsaizh_TW
dc.contributor.authorRu Jong Jengzh_TW
dc.contributor.authorChing Hsuan Linzh_TW
dc.contributor.author林慶炫zh_TW
dc.date2018-02-23-
dc.date.accessioned2019-11-06T01:58:44Z-
dc.date.available2019-11-06T01:58:44Z-
dc.identifier.urihttp://hdl.handle.net/11455/99202-
dc.description.abstractNORYL™ SA9000 resin is a commercialized telechelic PPO oligomer with phenyl methacrylate end groups. However, neat SA9000 thermoset is brittle after thermally curing. To find a method to enhance the toughness of neat SA9000 thermoset, three model reactions are designed. The first one is the 4-dimethylaminopyridine (DMAP)-catalyzed homopolymerization of glycidyl phenyl ether. The second one is the reaction of glycidyl phenyl ether and phenyl acetate in the presence of DMAP. The third one is the reaction of glycidyl phenyl ether and phenyl methacrylate in the presence DMAP. Through 1H NMR analysis, the product is 1,3-diphenoxy-2-acetoxypropane and 1,3-diphenoxy-2-methacryalatepropane, respectively, for model reactions 2 and 3. According to the structure of products, we identify the reaction mechanisms between the phenyl acetate and epoxy, and between the phenyl methacrylate and epoxy. Based on the knowledge, we used two commercialized epoxy resin (DGEBA and HP7200) to copolymerize with SA9000 in the presence of DMAP and tert-butyl cumyl peroxide (TBCP). The toughness of the thermosets are significantly improved, which means the brittle drawback of neat SA9000 thermoset has been solved. Homogeneous, flexible thermosetting films with high glass transition temperatures, low dielectric constants, and extremely low dissipation factors are obtained.zh_TW
dc.language.isoen_USzh_TW
dc.relationPolymer, Volume 140, 28 March 2018, Pages 225-232zh_TW
dc.relation.urihttps://www.sciencedirect.com/science/article/pii/S0032386118301708zh_TW
dc.subjectEpoxyzh_TW
dc.subjectPhenyl methacrylatezh_TW
dc.subjectReaction mechanismzh_TW
dc.titleIdentification of the reaction mechanism between phenyl methacrylate and epoxy and its application in preparing low-dielectric epoxy thermosets with flexibilityzh_TW
dc.typeJournal Articlezh_TW
dc.identifier.doi10.1016/j.polymer.2018.02.045zh_TW
dc.awards2018zh_TW
item.grantfulltextrestricted-
item.openairetypeJournal Article-
item.cerifentitytypePublications-
item.languageiso639-1en_US-
item.fulltextwith fulltext-
item.openairecristypehttp://purl.org/coar/resource_type/c_18cf-
Appears in Collections:化學工程學系所
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