Please use this identifier to cite or link to this item: http://hdl.handle.net/11455/99234
DC FieldValueLanguage
dc.contributor.authorBing-Hau Kuozh_TW
dc.contributor.authorDu-Cheng Tsaizh_TW
dc.contributor.authorYen-Lin Huangzh_TW
dc.contributor.authorPo-Chun Hsuzh_TW
dc.contributor.authorTung-Han Chuangzh_TW
dc.contributor.authorHsing-Hua Tsaizh_TW
dc.contributor.authorFuh-Sheng Shieuzh_TW
dc.date2018-07-26-
dc.date.accessioned2019-11-20T02:24:45Z-
dc.date.available2019-11-20T02:24:45Z-
dc.identifier.urihttp://hdl.handle.net/11455/99234-
dc.description.abstractSilver-based bonding wires such as Ag-4Pd and Ag-8Au-3Pd have drawn remarkable attention in the packaging industry because they are cheaper and more conductive than Au- and Cu-based wires, respectively. This study aimed to investigate the intermetallic compound (IMC) formation and growth at the bonding interface between Ag-4Pd wire and Al-pads and between Ag-8Au-3Pd wire and Al-pads. The as-bonded and reliability-tested Ag-4Pd/Al and Ag-8Au-3Pd/Al specimens were then investigated by transmission electron microscopy (TEM) and scanning transmission electron microscopy equipped with energy-dispersive X-ray spectroscopy (STEM-EDS). The bonding properties were examined by ball shear and wire pull tests. In the as-bonded state, hexagonal close-packed (HCP) (Ag, Pd)2Al and HCP Ag2Al were formed at the Ag-4Pd/Al interfaces, whereas dual phase consisting of face-centered cubic Ag alloy with HCP precipitates (Ag, Au, Pd)2Al crystals and HCP Ag2Al layers were observed at the Ag-8Au-3Pd/Al interfaces. The IMCs showed significant growth and oxidation during reliability tests at 130 °C and 85 pct relative humidity for 192 hours. Alloying Au in Ag-4Pd wires promoted the growth of the IMC layer and it also enhanced the mechanical properties in the as-bonded material. By contrast, overgrowth of the IMCs in the Ag-8Au-3Pd/Al system induced microcrack formation in bonding and thus degraded the reliability of the material.zh_TW
dc.language.isoen_USzh_TW
dc.relationMetallurgical and Materials Transactions A, Volume 49, Issue 11, pp 5411–5422zh_TW
dc.relation.urihttps://link.springer.com/article/10.1007/s11661-018-4841-7zh_TW
dc.titleEffect of Au Addition on the Microstructure and Properties of Ag-4Pd Bonding Wireszh_TW
dc.typeJournal Articlezh_TW
dc.identifier.doi10.1007/s11661-018-4841-7zh_TW
dc.awards2018zh_TW
item.grantfulltextnone-
item.openairetypeJournal Article-
item.cerifentitytypePublications-
item.languageiso639-1en_US-
item.fulltextno fulltext-
item.openairecristypehttp://purl.org/coar/resource_type/c_18cf-
Appears in Collections:材料科學與工程學系
Show simple item record
 

Google ScholarTM

Check

Altmetric

Altmetric


Items in DSpace are protected by copyright, with all rights reserved, unless otherwise indicated.