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|標題:||Light enhanced direct Cu bonding for advanced electronic assembly||作者:||Sin-Yong Liang
|Project:||Journal of Materials Science: Materials in Electronics, Volume 29, Issue 16, pp 14144–14150||摘要:||
An innovative and efficient surface modification pre-treatment that enhances Cu–Cu direct bonding through electromagnetic irradiation, including pulsed Xenon flash and near infrared rays is proposed. Without vacuum, short but critical electromagnetic radiation exposure on faying faces prior to bonding can significantly improve the joint strength up to 50% or even more. Copper atom diffusion acceleration by increased compressive residual surface stresses resulting from sudden heating/cooling accounts for the joint reinforcement. A close relationship between the increase in joint strength and the change in surface physics properties due to electromagnetic irradiations can be found.
|Appears in Collections:||材料科學與工程學系|
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