Please use this identifier to cite or link to this item:
標題: Light enhanced direct Cu bonding for advanced electronic assembly
作者: Sin-Yong Liang
Jenn-Ming Song
Shang-Kun Huang
Ying-Ta Chiu
David Tarng
Chih-Pin Hung
Project: Journal of Materials Science: Materials in Electronics, Volume 29, Issue 16, pp 14144–14150
An innovative and efficient surface modification pre-treatment that enhances Cu–Cu direct bonding through electromagnetic irradiation, including pulsed Xenon flash and near infrared rays is proposed. Without vacuum, short but critical electromagnetic radiation exposure on faying faces prior to bonding can significantly improve the joint strength up to 50% or even more. Copper atom diffusion acceleration by increased compressive residual surface stresses resulting from sudden heating/cooling accounts for the joint reinforcement. A close relationship between the increase in joint strength and the change in surface physics properties due to electromagnetic irradiations can be found.
DOI: 10.1007/s10854-018-9547-5
Appears in Collections:材料科學與工程學系

Show full item record

Google ScholarTM




Items in DSpace are protected by copyright, with all rights reserved, unless otherwise indicated.