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標題: 以離子銅作為印刷電路板金屬化觸媒之研究
The Study of Copper Ion as a Catalyst for Printed Circuit Board Metallization
作者: 張弘明
Hung-Ming Chang
關鍵字: 印刷電路板;觸媒;螯合物;無電電鍍銅;電鍍;Printed Circuit Board (PCB);Catalyst;Chelation;Electroless Copper Deposition;Electroplating
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Printed Circuit Board (PCB) is an important mechanical support for electronic components, it can transmit electronic signal on a non-conductive PCB by the etched copper patterns. With the progress of the times and since the rapid increase in technology, electronics components tend toward light, slim, short, small and low cost. Thus the PCBs, which are the important component of electronic products become high interconnection, multi-function, high reliability and portable performance. The metallization of a PCB with through holes is a key point step. Up to know, the traditional metallization process uses tin/palladium colloid or complexed palladium ion as a catalyst for electroless copper deposition to fabricate PCB. However, the price of palladium is risen year by year and it needs an extra palladium-removal process on the resin of semi-additive process (SAP) to prevent a possible short between two copper lines under consideration of reliability and quality for electronic products.
Since palladium is expensive and hard to be removed from a resin surface of SAP process. Herein, we develop a new catalyst for electroless process in this study and attempt to resolve the cost, process and reliability issues using palladium process. In recent years, more and more references were studying in other electroless catalyst. Metal-ion catalyst is one of the newest catalysts for non-conductive substrates metallization. In the light of this, we propose a complexed copper ion as a catalyst for electroless copper plating.
Because PCB metallization is consist of many chemical reaction processes and we aim for checking possibility of the complexed copper ion in electroless copper plating. We utilize quaternary amine as a conditioner for sidewall pre-treatment of through holes and then the chelators of complexed copper ion can chemically bond with conditioner. The PCB which is grafted with copper ions was reducted by a reducer to copper atom and initiate copper electroless reaction. In each step of electroless plating process, SEM, contact angle, XPS was used to examine properties and elements on the PCB. The results show that the performance of the complexed copper ion is as good as the palladium and it can pass the thermal reliability.
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