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標題: 低介電聚醚醯亞胺及環氧樹脂水性化之界面活性劑製備及應用
Synthesis, characterization and application of low-dielectric Polyetherimide and surfactants for epoxy/water emulsion
作者: 廖婉琳
Wan-Lin Liao
關鍵字: 低介電常數;聚醚醯亞胺;界面活性劑;環氧樹脂水性化;Low-dielectric;Polyetherimide;Surfactants;emulsion
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[Part I]
本實驗以 2,6-di-tert-butyl-4-methoxyphenol 及3-tert-butyl-4-hydroxy-anisole為原料,經由四步驟合成四系列二胺單體。

[Part II]
本實驗以1,4-丁二醇二缩水甘油醚在二氧化碳(CO2)環境下形成環碳酸酯(Cyclic Carbonates),再與胺基反應形成末端具有胺基之前驅物,接著再與環氧樹脂反應即可得到具有親水核心鏈段與疏水末端環氧鏈端之界面活性劑(C-4 Oxyalkylene Epoxy)。
將合成之C-4 Oxyalkylene Epoxy添加至環氧樹脂與水中可使環氧樹脂水性化,且添加 3 Wt % 即可達到最小粒徑,目前此概念已由長春人造樹脂集團開發當中。

[Part I]Synthesis, characterization and application of low dielectric Polyetherimide
Four novel aromatic diamines (S-T-NH2, F-T-NH2, S-DT-NH2, and F-DT-NH2) were successfully synthesized through four steps from 3-tert-butyl-4-hydroxyl-anisole.
Two series of polyimides (S and F-series polyimide) were prepared based the four dimaines and three commercial dianhydride (PMDA, ODPA, and 6FDA).
S-polyimides are soluble in common organic solvents because of the non-coplanar conformation of diphenylsulfone (ph-SO2-ph) linkage that retards the stacking of polyimide chains. On the other hand, F-polyimides has a better glass transition temperature due to the more coplanar conformation of perfluorobiphenyl linkage. The introduction of di-tert-butyl groups to increase the free volume, and thus improved the dielectric properties. Polyimides with dielectric constant as low as 2.56 U and dissipation factor as low as 4 mU can be obtained. 

[Part II] Surfactants for epoxy/water emulsion
A gemini surfactant (C-4-Oxyalkylene-Epoxy) with a core of hydroxyl urethane was successfully prepared through three steps from 1,4-butanediol diglycidyl ether.
An emulsion of bisphenol A-type epoxy in water can be obtained using 3 wt% C-4-Oxyalkylene-Epoxy as a surfactant. The particle size of the emulsion is 760 nm, and does not precipitate during storage. After curing with a water-soluble hardener, epoxy thermosets with adhesion 5B can be achieved.
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