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標題: A study of the copper process in ultra scale intergrated circuits using ion beam sputtering deposition
作者: 楊慶榮
jung, yang ching
關鍵字: copper;銅製程;ion beam;sputtering deposition;離子束;濺鍍沉積
出版社: 材料工程學研究所
Copper is in place of replaces aluminum as the advanced interconnect material in the ULSI industry because of its lower resistivity and better performance in electromigration. Currently, copper is deposited by electroplating. However,it need an adhesion / barrier layer and high — quality seed layer prior to electroplating required. Electroless copper plating is considered as an alternative, due to the advantages of lower cost as compared to other techniques such as CVD and PVD.
The quality of electroless copper films depends on the nature of the substrate and its subsequent of copper was prepared. In this study, a seed layer by IBSD(Ion Beam Sputtering Deposition) on the surface of TaN. Electroless deposition of copper film was carried out on the seed layer. Post annealing at various temperatures,the electroless copper is subject to analysis by X-ray and FESEM for understanding the change in microstructure.
The results indicate that the copper seed layer is helpful not only is the protection of TaN from etching, but also is obtaining higher ratio of Cu(111) to Cu(200) crystals. Annealing of the electroless copper at higher temperatures also increase the ratio of Cu(111) to Cu(200), thus improving the texture of copper films.
The analysis techniques used in this work are: (1)X-ray Diffraction(XRD)for determining the crystal structure;(2)Field Emission Scanning Electron Microscopy(FESEM)for observation the surface morphologies;(3)Secondary Ion Mass Spectrometer(SIMS)for investigating the depth profile of elements;(4)Atomic Force Microscopy(AFM)for exploring the surface morphologies.

摘 要
本論文所涵蓋之分析技術有:(1)X光繞射儀(X-ray Diffractometer ; XRD)測定晶體結構、(2)場發射式電子顯微鏡(Field Emission Scanning Electron Microscope ; FESEM)研究表面形態、(3)二次離子質譜儀(Secondary Ion Mass Spectrometer ; SIMS)做縱深成分分佈分析、(4)原子力顯微鏡(Atomic Force Microscope ; AFM)探討表面形態。
Appears in Collections:材料科學與工程學系

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